Corporate Governance

CG One | CG Two | CG Three

Corporate Governance

CG One | CG Two | CG Three

Corporate Governance

CG One | CG Two | CG Three

History

In the late 1960s, the company’s founder, Sherwin Seligsohn, envisioned a communications system that would allow him to trade stocks while sitting on the beach — quite ambitious in a time when analog cellular phones were not yet available. A few years later in 1972, International Mobile Machines Corporation - the predecessor company to InterDigital - was incorporated in Philadelphia, Pennsylvania.

In the late 1970s, before digital cellular networks were introduced in the U.S., InterDigital started to develop TDMA – Time Division Multiple Access – technology for use in digital wireless telephone systems. Its engineers, experts in RF Engineering, were driven by the dream of developing new technology that would allow people to communicate more effectively. InterDigital’s founder envisioned this technology as being spread throughout the world in one huge network.

During these early days, the company recognized that the breakthrough technologies it had developed had great potential, but were well-ahead of mass-market adoption and commercialization. Being a very small company at that time, InterDigital was not in a position to create a market by itself and decided to secure its interests by patenting its inventions. InterDigital had its IPO in 1981, which provided the necessary funding to expand into product development.

In the mid 1980s, InterDigital developed UltraPhone®, a wireless local loop system. First installed in the U.S., orders quickly followed from Mexico, Indonesia, Philippines, and other countries where wireline telephone service did not exist – eventually selling 345 systems.

By the early 1990s, the telecommunications industry in the U.S., quite familiar now with digital cellular networks, was divided into two camps – TDMA and CDMA. InterDigital at this time was known as the “TDMA Company” and TDMA was the dominant of the two technologies with support from most of the Regional Bell Operating Companies (RBOCs) and AT&T.

In 1992, through a strategic acquisition of SCS Mobilecom/Telecom, a small private company with Spread Spectrum CDMA technology, InterDigital became one of only a few companies in the industry with expertise in both TDMA and CDMA technologies. This milestone event boosted the company’s technical expertise and positioned it to move into product development. Not long after, InterDigital demonstrated its Broadband Code Division Multiple Access™ (B-CDMA) technology, transmitting voice and data at ISDN rates from a subscriber unit traveling in an automobile at its technology development center in Melville, NY.

Widely recognized as the forerunner of today’s WCDMA technology, this was an important early step toward delivering simultaneous high speed data transmission, wireline quality voice and multimedia applications - including video conferencing. While this initial B-CDMA technology was designed for the wireless local loop market, InterDigital continued the development of broadband technologies recognizing their potential for third generation solutions being contemplated across the world at that time.

InterDigital became a key contributor to the leading standards bodies with innovations in more efficient algorithms for faster data speeds, increased network capacity, improved battery life, etc. Having been one of the architects of 2G/2.5G technologies, the company also became a major player in 3G with its inventions in WCDMA (Wideband CDMA).

By the end of the decade, InterDigital had built a successful patent licensing program, having licensing agreements in place with many of the world’s leading manufacturers of mobile phones. Its 3G technology programs also received accolades from across the industry, resulting in collaborative development agreements with Nokia and Infineon.

Around the turn of the millennium, InterDigital became active in the evolution of 3G with HSDPA (High Speed Download Packet Access) and HSUPA (High Speed Upload Packet Access) breakthroughs enabling true wireless broadband with data speeds over 10 Mbps for mobile computing, multimedia, gaming and commerce - forever changing the paradigm of mobile “telephony”. By 2006, the company’s patent licensing program had generated over one billion dollars and the company embarked on the development of its own high-performance dual mode modem ASIC with HSDPA and HSUPA, targeting data-centric devices.

Today, InterDigital continues to be extremely active in the standards process – both in the U.S. and internationally - contributing its ideas and intellectual property along with other companies in shaping the evolution of the wireless industry.

Stock FAQ

I hold a stock certificate for International Mobile Machines (or InterDigital Communications Corporation). How do I change it to InterDigital, Inc.?

It is not necessary to change an International Mobile Machines or an InterDigital Communications Corporation stock certificate to an InterDigital, Inc. certificate.  All outstanding shares of either entity were converted automatically into shares of InterDigital, Inc. on a share-for-share basis.  If you would like to change your certificate, contact our Transfer Agent, American Stock and Transfer at +1 800 937 5449 or visit www.amstock.com.

How do I make changes to my InterDigital account?

If you purchased your shares through a broker, your shares are held in Street name. You need to contact that broker to make changes to your account. If you have your stock certificate, you are a Shareholder of Record. You may contact InterDigital's transfer agent, American Stock Transfer & Trust, at +1 800 937 5449 or visit www.amstock.com. Be sure to inform the transfer agent if you have a change of address.

What is the CUSIP for InterDigital's Common Stock?

InterDigital's Common Stock CUSIP number is 45867 G 101.

Does InterDigital pay a dividend?

InterDigital has not paid cash dividends on its common stock since inception.  It is anticipated that in the foreseeable future, without regard to any cash proceeds the company may receive from any settlement or resolution of outstanding arbitrations or litigations, no cash dividends will be paid on the common stock.  Any cash otherwise available for such dividends will be reinvested in the company's business or used to repurchase common stock.  When considering whether or not to pay cash dividends, InterDigital's Board of Directors assesses earnings, any dividend requirements on Preferred Stock if issued in the future, capital requirements and other relevant factors. 

When was InterDigital's initial public offering and what was the opening price?

InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 at an initial price of $3.00 per share.

Did InterDigital’s stock trade under any symbols other than IDCC?

InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 and the company’s Common Stock began trading on the NASDAQ Global Select Market system under the ticker symbol IMMC. On May 26, 1992, company’s Common stock began trading on the American Stock Exchange under the ticker symbol IMM. In 1992, the company changed its name to InterDigital Communications Corporation and on October 19, 1992, the company’s ticker symbol changed to IDC. On April 26, 2000, the company's Common Stock began trading on the NASDAQ Market under the symbol IDCC.

On July 2, 2007, InterDigital Communications Corporation, the company’s predecessor, filed a Form 8-K announcing an internal corporate restructuring, which resulted in InterDigital, Inc. being substituted as the publicly-traded company.  To indicate this substitution event, NASDAQ implemented a 20-trading day transition period on July 9, 2007, temporarily changing the company’s trading symbol from “IDCC” to “IDCCD.”  Beginning at market open on August 6, 2007, InterDigital, Inc.’s common stock trades on the NASDAQ Global Select Market under the ticker symbol “IDCC.”
 

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Legal Notice

Legal Notices

COPYRIGHT. All contents of this site such as text, graphics, images, audio clips and data compilations are the property of InterDigital, Inc. or its content suppliers and are protected by copyright law. No portion of the information on this web site may be copied or reproduced in any form, or by any means without prior written permission from InterDigital. Visitors to this site are not permitted to modify, distribute, publish, post, transmit or create derivative works of any material found on this site for any commercial or non-private purposes.

TRADEMARKS. The trademarks, service marks and logos displayed on InterDigital’s web site are the property of InterDigital, Inc. or third parties. Visitors to this site are not permitted to use these marks without the prior written consent of InterDigital (or the third party which may own the mark).

DISCLAIMER. ALL INFORMATION PROVIDED ON THIS WEB SITE IS PROVIDED "AS IS," WITHOUT WARRANTY OF ANY KIND, EXPRESSED OR IMPLIED. InterDigital assumes no responsibility for the accuracy or completeness of the information and may change the contents at any time without notice.

About the Industry

Today, it would be hard to imagine a world without mobile phones. Wireless technologies have changed the way we work, live, and play. By typical measures, the wireless market would be considered mature, but the reality is that the wireless industry is changing faster than ever before, with new technologies, products, applications, and services being introduced daily. As technologies, content, and devices blossom, the only limit on the opportunity for InterDigital is our imagination.

Useful Resources:

Actual market data and forecasts from leading industry analysts

GSM World

The Global Mobile Suppliers Association

The CDMA Development Group

Cellular Telephone Basics Article

 

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Industry Events 

Mobile World Congress

February 11-14, 2008
Barcelona, Spain

Contact

Tel: +1-631-622-4132

Email:  customer_support@interdigital.com

Note:  There is a limit of 7,000 characters in the email body, if you have a large amount of text exceeding 7,000 characters, attach your document to the email. 

Customer Sign-in

To access the secure login, click here

Corporate Governance


We are constantly seeking to build an organization that will drive substantial shareholder value. In doing so, we are committed to a well-defined and broadly communicated corporate governance policy that will protect our shareholders’ interests. An experienced and majority-independent board of directors with entirely independent committees provides the oversight function, which is a central element in sound corporate governance. In 2003, we codified our corporate governance guidelines and established a mechanism for shareholder communication with the Board of Directors.

Investors are invited to learn more about InterDigital's corporate governance guidelines--as well as information on Board members, committees and committee charters, by-laws, and InterDigital's code of business conduct and ethics.

Analyst Coverage

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SEC Filings

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Annual Reports

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Events / Presentations

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 Stock Facts

Q.I hold a stock certificate for International Mobile Machines. How do I change it to InterDigital Communications Corporation?
A.It is not necessary to change an International Mobile Machines stock certificate to an InterDigital Communications Corporation stock certificate. If you would like to change the certificates, contact our Transfer Agent at +1 800 937 5449 or visit www.amstock.com.


Q.How do I make changes to my InterDigital Communications Corporation account?
A.If you purchased your shares through a broker, your shares are held in Street name. You need to contact that broker to make changes to your account. If you have your stock certificate, you are a Shareholder of Record. You may contact InterDigital’s transfer agent, American Stock Transfer & Trust, at +1 800 937 5449 or visit www.amstock.com. Be sure to inform the transfer agent if you have a change of address.

Q.What is the CUSIP for InterDigital’s Common Stock?
A.InterDigital’s Common Stock CUSIP number is 45866A105.

Q.Does InterDigital pay a dividend?
A.InterDigital’s Common Stock does not pay a dividend. 

Q.When was InterDigital’s initial public offering and what was the opening price?
A.InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 at an initial price of $3.00 per share.

Q.Did InterDigital’s stock trade under any symbols other than IDCC?
A. InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 and the Company’s Common Stock began trading on the Nasdaq Global Select Market system under the ticker symbol IMMC. On May 26, 1992, Company’s Common stock began trading on the American Stock Exchange under the ticker symbol IMM. In 1992, the Company changed its name to InterDigital Communications Corporation and on October 19, 1992, the Company’s ticker symbol changed to IDC. On April 26, 2000, the Company’s Common Stock began trading on the Nasdaq Global Select Market under the symbol IDCC.

Investor Relations

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Press Releases

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Press Center

InterDigital's management and key personnel are available to share their insights into most aspects
of the wireless industry. We invite members from the press and industry analysts to contact us on
topics relating to the following items:

  • The evolution of the wireless industry, technologies and markets
  • The wireless standardization process
  • Innovation, intellectual property rights and technology and patent icensing

The Faces of InterDigital

    

We embrace the unique backgrounds, perspectives, and creativity of our diverse work force. Our employees thrive in this open, challenging, and rewarding work environment.

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Afshin Haghighat - Senior Staff Engineer, Montreal
“The best thing about InterDigital is the people; I am surrounded by a group of very professional and talented people. Unlike many other companies, at InterDigital you don’t have to be on top of the pyramid to have an influence on a project. There is no one-man project here; people work and push every project forward as a team. InterDigital is a very ambitious company. We are given aggressive goals along with an excellent level of training. And that is good, because as an engineer, you always want to do new things and continue learning.”

Afshin Haghighat  earned his Masters of Science Degree and  Ph.D. from Concordia University.

Yi Zhang - Accountant, King of Prussia
“This company is like a big family. Everyone is so friendly and open, and they really teach me a lot. I feel so lucky to work here, and because it is a small company, everyone knows each other and there is better communication with the people you work with. It’s not just a job to me because I make friends here. If it’s only a job, then you can’t enjoy it. And this is really a peaceful place.”

Yi Zhang holds a Bachelor’s Degree in Finance Management. from Wuhan University, and attended the University of Colorado where she earned her Masters in Accounting.

Frederic Monfet - Senior Engineer, Montreal
“Since I started working at InterDigital, I’m more inclined to take challenges. At the beginning of 2006, I was given the opportunity to work in the software area and perform integration of hardware and software in the lab for a 6 month period. This occasion allowed me to extend my experience and learn about new areas, making my job even more interesting.”

Frederic Monfet is from a small town north-east of Montreal, called Shawinigan. He moved to Montreal to study at Concordia University and earn his Bachelor’s Degree in Electrical Engineering. Frederic continued his education at the neighboring McGill University, and graduated with a Masters Degree in Electrical Engineering.

Gregg Charlton - Member Technical Staff, King of Prussia
“The difference between working at InterDigital and a larger company is that here, there is more flexibility within the engineering workforce and management encourages employees to branch out into different areas of expertise, whereas at a larger company, you tend to get pigeonholed in one particular task. There is a team mentality here, and people are willing to go the extra mile to get their work done in accordance with the highest standards. Your contributions really make a difference here, and you won’t become a number.”

Gregg Charlton graduated with a BSEE from Carnegie Mellon University  and later earned his MSEE. at the University of Michigan.

Lakshmi Erukulapati - Staff Software Engineer, Melville
“InterDigital’s great commitment to employees’ education and flexibility helps people enhance their knowledge in their areas of interest. I find myself working with a very diverse group of people from many different countries and cultures. But one thing common across the board, is my coworkers’ drive for success and commitment to goals. Since it is a small group of people, we get to know each other not only from technical point of view, but at a personal level. Personally I am amazed at how the people in this group are always willing to help and guide you in the right direction. We not only get a chance to work with the latest technology here, we work with a group of people who are greatly knowledgeable, yet humble. As a team we look forward to facing new challenges, because we know we can meet them. And personally, I look forward to my day at InterDigital everyday.”

Lakshmi got her start in engineering at the Indian Institute of Technology earning a Master’s Degree in Technology with a concentration in Computer Science and Engineering. She spent two years working for Hughes Software Systems in India before starting at InterDigital in February 2001. As a Staff Engineer in the Software Department, Lakshmi contributes to all phases of  product development, starting from the architecture phase of the product, through the field testing phase.

Catherine Livet - Staff Systems Engineer, Montreal
“One advantage I find in the Montreal office is the cultural diversity of my co-workers. This diversity brings the globalization reality into our day-to-day work, and it helps us to better understand the global market.

Catherine Livet attended engineering school in Bordeaux, France, where she earned the French equivalent to a Bachelor’s Degree in Electrical Engineering. Catherine emigrated from France to Canada 7 years ago, and is now a citizen of both countries. 

Working at InterDigital

We promote a balanced lifestyle, where reaching your professional and personal goals are equally important. In addition to our generous compensation and benefits plans, we foster an environment where company-sponsored activities for employees and their families and recreational events are offered and giving back to our local communities is strongly encouraged.

      

Community Involvement

InterDigital believes that a company is also a community.  In addition to celebrating company and personal successes, we place a high value on sharing our time and resources with those less fortunate. We sponsor company initiatives involving local organizations as well as contributing to a range of global/local charitable efforts.

Fun at Work

We believe in the old adage: “work hard, play hard.”  In addition to our annual company sponsored events,  we have a very active Recreation Committee that organizes activities throughout the year, promoting a healthy dose of fun, camaraderie and a bit of stress relief to boot!

Where We Live, Work, and Play

If you are contemplating joining our exciting team at any of our locations, here are some links with useful information about our communities:

  • King of Prussia, a thriving western suburb of Philadelphia, Pennsylvania

www.kingofprussia.com

  • Melville, close proximity to New York City and the quaint beaches of Long Island, New York

http://fordyce.org/long_island

www.exploreli.com/entertainment/localguide

  • Montreal, a dynamic cosmopolitan Canadian city, rich in culture and tradition

www.montrealinternational.com/en/accueil/index.aspx

http://ville.montreal.qc.ca/portal/page?_pageid=65,38111&_dad=portal&_schema=PORTAL

 

Career Opportunities

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Highly Competitive Compensation & Benefits

InterDigital provides a comprehensive compensation and benefits package, including:

  • Competitive, Market-Driven Base Salaries
  • Short and Long Term Cash and Equity-based Bonus/Incentive Compensation Plans
  • Profit Sharing
  • 401k Plan with Company Match
  • Company-Paid Holidays
  • Paid Time Off (Starting at 18 Days Annual Accrual)
  • Health Benefits, including Medical, Dental, Vision and Prescription Drug Program
  • Short and Long Term Disability Plans 
  • Life Insurance and AD&D Plans
  • Flexible Spending Accounts (Medical and Dependent Care)
  • Employee Stock Purchase Plan
  • 529 College Savings Plan
  • Employee Referral Program
  • Tuition Reimbursement and Company-sponsored Training Curriculum
  • Employee Assistance Program
  • Credit Union
  • Direct Deposit
  • Fitness and Wellness Programs (some facilities have on-site fitness centers)

Passionate About Shaping the Future?

Our innovations, technology breakthroughs, and commercial successes are grounded on having the brightest, most talented, and most dedicated individuals in the industry. Our employees are clearly an enormous asset. Our pioneering legacy, technical abilities, and strong patent holdings are admired by both our customers and competitors around the world.

InterDigital strives to foster a diverse and stimulating environment where creative, intelligent, and ambitious people can achieve their professional and personal goals. At InterDigital, we support an entrepreneurial culture with solid resources, structure and stability to make a big impact on the future of wireless communications. Everyone contributes directly to the company’s strategic goals and bottom line – hands-on using a team-oriented approach.

InterDigital has a wide variety of exciting career opportunities for skilled professionals, and an environment that supports innovation and excellence.  InterDigital is an equal opportunity employer supporting diversity in the workplace. 

By the end of this decade, over 3 billion people will use a mobile phone. If you join InterDigital, you can have your fingerprints on this exciting future.

Contact

Corporate Headquarters

InterDigital
781 Third Avenue
King of Prussia, Pennsylvania, 19406 USA
Tel: +1 610-878-7800
Fax: +1 610-878-7842

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Additional Development Centers

InterDigital
2 Huntington Quadrangle
4th Floor, South Wing
Melville, New York, 11747 USA
Tel: +1 631-622-4000
Fax: +1 631-622-0100

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InterDigital Canada, Lteé
1000 Sherbrooke Street West
10th Floor
Montreal, Quebec, H3A 3G4 Canada
Tel: +1 514-904-6300
Fax: +1 514-904-6344

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Investor Relations

Janet Meenehan Point
Executive Vice President,
Communications and Investor Relations

Tel: +1 610-878-7866
Fax: +1 610-878-7842
Email: janet.point@interdigital.com

Media Relations

Jack Indekeu
Director - Corporate Marketing
Tel: +1 610-878-5737
Fax: +1 610-878-7842
Email: jack.indekeu@interdigital.com

Technology & Products

Brett Attebery
Senior Manager, Strategic Planning
Tel: +1 610-878-5661
Fax: +1 610-878-7842
Email: sales@interdigital.com

Webmaster

Email: Webmaster@interdigital.com

Global Licensing Expertise

Among InterDigital’s licensees are many of the world’s leading brands and manufacturers. Throughout our history, we have established patent license agreements covering one or more standards with almost 40 manufacturers of wireless equipment including:

  • Apple
  • LG
  • NEC
  • Sharp
  • Research in Motion
  • Ericsson
  • High Tech Computer
  • Nokia
  • Samsung
  • Sony-Ericsson


Our patent licensing organization can guide you through the complex landscape of global standards and tailor a program to your company's specific needs.

Fundamental Breakthroughs

Below is a sampling of key technologies covered by our patent portfolio, which exceeds 12,000 U.S. and foreign issued patents and patent applications:

Seamless Handover

Increases coverage, accommodates more users and saves battery life.

Joint Detection and Interference Cancellation

Cancels out extraneous noise for a clearer and crisper reception.

Fundamental System Architecture

InterDigital developed the basic design concepts and methodologies by which most commercial TDMA and CDMA wireless systems are implemented worldwide.

Bandwidth on Demand

Enables systems to allocate bandwidth in an extremely efficient manner, increasing the capacity of a wireless system.

Power Control

Superior power control technology to maximize system capacity and minimize signal interference and degradation.

Packet Data

An extremely efficient method of transporting packet data over a radio signal, thereby increasing radio system capacity.

Global Pilot Channel

A reference signal transmitted by the base station that allows reliable and robust communications by all mobile users.

A listing of InterDigital's US patents can be found on the US Patent and Trademark Office website.

Our Inventions Lie at the Heart of
Wireless Communications

Our know-how and inventions reach across virtually all mobile and wireless devices. InterDigital holds over 3,000 U.S. and foreign issued patents combined. In addition, we have nearly 9,000 patent applications in process. Our success in increasing the pace and breadth of our innovation business reflects our fundamental commitment to remain an industry leader in the creation of pioneering wireless technologies. We have a comprehensive program of developing and protecting our intellectual property through the worldwide filing and issuance of our patents.

InterDigital’s licensing practices are considered exemplary by licensing and industry experts. In 2006, in recognition of our licensing program success, InterDigital received the prestigious Licensing Achievement Award from the Licensing Executives Society.  The company is also a founding member of the Innovation Alliance- a coalition of entrepreneurial companies seeking to enhance America’s innovation environment by improving the quality of patents granted and protecting the integrity of the U.S. patent system. 

Product, Engineering, Integration Support

InterDigital offers semiconductor suppliers and terminal OEMs a full customer care suite for timely, innovative, and differentiated productizing. We provide extensive and complete 24/7 product support, maintenance, and engineering services for fast and easy integration. Customers can leverage our experience in GCF testing, FTA, and IOT with major network operators around the world.

Complete 2G/3G System Development and Testing

InterDigital is qualified in 2G/3G system design, hardware, software, and services. We have built equally equipped system test facilities in three locations ready to run unit test, host, target conformance and performance test programs. We bring multi-site development tools and trained personnel for tight collaboration at your location, anywhere across the globe.

  • Extensive expertise in:
    • L1, L2/3, and RF design
    • Platform customization
    • Full pre-FTA and IOT
    • Certification on-site support
  • ISO 9001:2000 certified
  • Successful programs with industry leaders such as Nokia, Infineon, Samsung, Philips, Siemens, Alcatel, General Dynamics
  • Complete product life-cycle engineering support from product conception to design, test, deployment, and maintenance
  • 24/7 global response
  • Customer support website for 24/7 online support and issue tracking
  • Quarterly maintenance updates
  • Customer product training

Optimized for Tomorrow’s
Data-Intensive Products

The InterDigital dual mode reference platform has been optimized for tomorrow’s high-performance data-intensive products and services. Targeting wireless notebooks, the IPC6071-R Reference Platform offers faster data, faster time to market, and a future-proof product roadmap for the booming wireless computing market. The reference platform—built around the high-performance baseband ASIC from InterDigital—is optimized for ExpressCard, PCI-e Mini Cards, or USB sticks and soon to be followed by a Half Mini-Card platform.

The IPC6071-R Reference Platform is virtually plug-and-play, featuring:

  • InterDigital dual mode baseband ASIC with high-performance HSDPA and HSUPA
  • Complete dual mode protocol stack for 2G and 3G
  • Advanced Receiver Technology with receive diversity
  • Data-intensive applications and interfaces
  • Small form factor, easy and fast PC-connectivity, and power-efficient design
  • Enhanced security
  • Extensive service and support

High-Performance, Dual Mode Baseband ASICs

pic_33_smallerInterDigital offers high-performance dual mode baseband ASICs leveraging our advanced modem core. The efficient integration of the dual mode physical layer and dual mode protocol stack is optimized for maximum performance, power-efficiency, small size, and low cost. We have an arrangement with a leading semiconductor fabricator assuring state-of-the processes and quality, and a steady supply.

 Advanced Receiver Technology

Our best-in-class Advanced Receiver Technology operates with a single antenna or dual antenna diversity.   This high performance receiver maximizes throughput and coverage, differentiating these baseband ASICs from the competition.

The IPC6071 R6 baseband ASIC targets PC Cards and other high-performance data-intensive products and applications, featuring throughputs of up to 7.2 Mbps in the downlink and up to 1.5 Mbps in the uplink. Its successor devices will provide up to 10Mbps downlink and 5.8 Mbps uplink in a “slim modem” architecture that addresses both data cards for notebooks and ultra mobile PCs and the high-end feature phone/smart phone market segment.

Best-in-Class Modem Technologies

pic_31_smallerInterDigital offers semiconductor suppliers and terminal OEMs complete 2G/3G dual mode modem technology with high-performance HSDPA and HSUPA. Our standards compliant platform includes the layer 1 baseband and layer 2/3 protocol stack software for GSM, GPRS, EDGE, WCDMA, HSDPA and HSUPA modes. The 2G/3G physical layers are integrated with efficient dual mode protocol stack software with field-proven fully-certified inter-RAT. Leading semiconductor companies incorporate our technology into their products.

Our modem technology offering includes:

  • Proven, best-in-class 2G baseband solution
  • High-performance, low-power, scalable 3G baseband solution
  • R6 dual mode protocol stack
  • Complete reference platform, service and support

 

Taking IP to Silicon

The original vision of 3G is rapidly becoming reality with the deployment of advanced mobile devices using HSDPA and HSUPA. Leveraging over 30 years of wireless modem development experience, InterDigital markets a full range of enabling solutions – from dual mode modem technology, to high-performance baseband ASICs, to complete reference platforms.

Get to Market Faster and with Best-in-Class Performance

Our solutions deliver best-in-class performance with industry leading data rates and receiver performance, small size, low power consumption and reduced costs. And InterDigital’s full service and support ensures that semiconductor companies and mobile device manufacturers get to market early with superior and differentiated products.

The InterDigital Advantage

What our customers value most is our decades of skill and experience –“The InterDigital Advantage," unmatched anywhere:

  • Over 30 years of discovery and innovation
  • Pioneering and leadership in the development of wireless communication technologies
  • An exciting product and technology roadmap
  • Key contributions to the global wireless standards, helping to shape the evolution of the industry
  • A track-record in the delivery of best-in-class air interface technology and high-performance wireless modems

Customers, Licensees and Strategic Relationships

Throughout our history, InterDigital has been on the forefront of wireless innovations around the world.  The company’s business relationships, patent licenses, and product and technology deployments reach across the globe.

Here is a sampling of InterDigital’s customers, licensees and strategic relatonships that are among the world’s most successful companies and popular brands today:

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Committed to Building Shareholder Value

Comprised of senior executives with broad industry experience, the InterDigital leadership team is committed to delivering shareholder value.  Proud of the company’s market success to date, the group continues to support strong investments in business opportunities in the wireless sector.

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Board of Directors

Harry G. Campagna - Chairman of the Board, InterDigital; President and Chief Executive Officer, Chairman of the Board, Oualitex Co.

HARRY G. CAMPAGNA Chairman of the Board of Directors, has been a director of the Company since April 1994. Mr. Campagna has been the President, Chief Executive Officer and Chairman of the Board of Directors of Qualitex Co. for more than the past five years. Qualitex Co. is involved in the manufacturing of items for the garment apparel and textile maintenance industries.

D. Ridgely Bolgiano - Chief Scientist and Vice President, InterDigital

D. RIDGELY BOLGIANO has been a director of the Company since 1981. Mr. Bolgiano has been a Vice President and Chief Scientist of the Company since April 1984, and has served as Chairman of the Board of Directors of InterDigital Technology Corporation, a wholly-owned subsidiary of the Company, since May 1996. Mr. Bolgiano has been affiliated with the Company in various capacities since 1974.

Steven T. Clontz - Executive Director, President and Chief Executive Officer, StarHub Ltd.

STEVEN T. CLONTZ became a director of the Company in April 1998. Mr. Clontz has, since January 1999 served as President and Chief Executive Officer of StarHub, Ltd. (StarHub), a Singapore-based info-communications corporation providing a full range of information, communications and entertainment services over fixed, mobile, Internet and cable TV networks. Mr. Clontz has also served as an executive director of StarHub since 1999 and as an executive director of six of its affiliates. In April 2005, Mr. Clontz was appointed to the Board of Directors of Equinix, Inc., a leading global provider of network-neutral data centers and Internet exchange services headquartered in California. In February 2004, Mr. Clontz was appointed to the Executive Committee of the Board of Directors of Global Crossing Limited, a Bermuda corporation, which provides telecommunications solutions over a global IP-based network.

Edward B.  Kamins - Corporate Senior Vice President, Chief Operational Excellence Officer, Avnet, Inc.

EDWARD B. KAMINS became a director of the Company in December 2003. Mr. Kamins has, since July 2005, served as Chief Operational Excellence Officer of Avnet, Inc. (Avnet), a B2B provider of supply chain management and engineering services, and a global distributor of semiconductors, enterprise networks and computer equipment, and embedded subsystems from leading manufacturers. Mr. Kamins continues to serve as Avnet’s Corporate Senior Vice President, a position he has held since July 2003 when he was promoted to Chief Information Officer. Mr. Kamins joined Avnet in 1996 as Senior Vice President of Business Development for Avnet Computer Marketing. In October 1999, Mr. Kamins was named President of Avnet Applied Computing, a new operating group chartered to serve customers’ embedded computing needs.

William J. Merritt - President, Chief Executive Officer and Director, InterDigital

WILLIAM J. MERRITT became a director of the Company in May 2005.  Mr. Merritt has also served as Chief Executive Officer and President of the Company since May 2005, and as President of InterDigital Technology Corporation since July 2001.  Mr. Merritt served as General Patent Counsel of the Company from July 2001 to May 2005, and General Counsel and Secretary from October 1998 to July 2001.  In addition, Mr. Merritt was Vice President, Legal and Assistant Secretary from January 1996 to October 1998.

Robert S. Roath - Chief Financial Officer (Retired), RJR Nabisco, Inc.

ROBERT S. ROATH has been a director of the Company since May 1997. Mr. Roath served as Chief Financial Officer and Senior Vice President of RJR Nabisco, Inc. (RJR Nabisco) from April 1995 to April 1997 and Corporate Controller and Senior Vice President at RJR Nabisco from September 1990 to April 1995. Mr. Roath has been a Director of Standard Parking, a provider of parking management services, since May 2004. He also serves as Chairman of Standard Parking’s Audit Committee.

Robert W. Shaner - President (Retired), Cingular Wireless LLC

ROBERT W. SHANER has been a director of the Company since December 2003. From January 2004 to present, Mr. Shaner has served as founder and managing partner of Performance Management, LLC, a professional management consulting firm specializing in the optimization of business performance. From February until September 2004, Mr. Shaner served as Interim Chief Executive Officer of REMEC, Inc., a developer and manufacturer of telecommunications infrastructure products for voice, video and data transfer over wireless networks and sophisticated microwave electronic subsystems for defense radar, communications, and electronic warfare applications. From January 2001 to February 2003, Mr. Shaner served as President of Wireless Operations for Cingular Wireless LLC, a joint venture between the wireless divisions of SBC Communications Inc. and BellSouth Corporation. From November 1999 to January 2001, Mr. Shaner served as the Regional President of SBC Wireless, Inc., a provider of wireless communication services to consumers and businesses. Prior to 1999, Mr. Shaner served in various executive capacities at SBC-related companies. Mr. Shaner also serves as a director of Mobility Electronics, Inc.

 

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Executive Management


William J. Merritt - President, Chief Executive Officer and Director

WILLIAM J. MERRITT is InterDigital’s President and Chief Executive Officer, and a member of the Board of Directors.

Prior to becoming President and Chief Executive Officer, Mr. Merritt played a key role in building a program of licensing InterDigital's intellectual property and overseeing the growth in its patent licensing business.  Before that, Mr. Merritt was Executive Vice President, General Counsel and Secretary of InterDigital.  Prior to joining InterDigital in 1996, he served as Assistant General Counsel with the Long Island Lighting Company in Hicksville, NY.  Earlier on, Mr. Merritt had concentrated his engineering efforts with Public Service Electric and Gas Company and Stone & Webster.

Mr. Merritt earned a Bachelor of Science degree in Mechanical Engineering from the Rensselaer Polytechnic Institute in 1980 and a Juris Doctorate from Temple University in 1987.  Mr. Merritt serves on the Board of Directors for AmberWave Systems Corporation, a privately-held developer of intellectual property relating to strained silicon and other advanced material technologies for the semiconductor industry.

Gary D. Isaacs - Chief Administrative Officer

GARY D. ISAACS is Chief Administrative Officer of InterDigital, responsible for overseeing Human Resources, Information Systems Technology and Corporate Services across all InterDigital locations.

Mr. Isaacs joined InterDigital in September 1998, after spending three years at RCN Corporation, a rapidly emerging telecommunications company based in Princeton, NJ, where he was VP, Human Resources. Mr. Isaacs has more than 25 years of human resources management experience across several industries including telecom, aerospace and consumer products. He has worked for very large Fortune 50 companies including the Kraft Foods division of Philip Morris Cos. and Lockheed Martin, as well as small to medium size companies such as RCN Corp. Mr. Isaacs began his human resources career with People Express Airlines in 1983 and was part of the rapid growth and expansion of that upstart company.

Mr. Isaacs attended college at The University of Manchester, England as part of a select international communications program prior to graduating with a BA in journalism from Penn State University in 1981.

Brian G. Kiernan - Executive Vice President, Standards

BRIAN G. KIERNAN is Executive Vice President, Standards of InterDigital, responsible for the development of new market and product initiatives and the coordination of InterDigital's worldwide standards activities.

Mr. Kiernan has been with InterDigital since 1984. As Vice President of Engineering during the development of the UltraPhone® product, Mr. Kiernan was a principal contributor to InterDigital's extensive portfolio of intellectual property. He has wide–ranging hands-on experience in international markets and extensive knowledge of the U.S. and international standards process. Before joining InterDigital, Mr. Kiernan was a Senior Staff Engineer at GTE Products Corporation. His prior program and technical management experience encompassed both TDMA and CDMA voice and data systems, digital and analog switching, and VHF/UHF and microwave radio.

Mr. Kiernan earned a BSEE from Newark College of Engineering and a MS Management Science from Fairleigh Dickinson University.

Mark A. Lemmo - Executive Vice President, Business Development and Product Management

MARK A. LEMMO is Executive Vice President, Business Development and Product Management of InterDigital, responsible for InterDigital’s product development and marketing organization.

Mr. Lemmo has been with the company since 1987, and has led the establishment and growth of a number of key strategic partnerships.  Previously, Mr. Lemmo held the position of Executive Vice President, Engineering and Product Operations since October 1996.  In that position Mr. Lemmo managed the engineering and production resources devoted to the Company’s fixed and mobile wireless product lines.  Mr. Lemmo possesses a deep understanding of both TDMA and CDMA technologies and engineering operations, having received several patents in these areas. His knowledge of the telecommunications marketplace for current and future products is a vital contributor to InterDigital’s strategic focus.  Prior to joining InterDigital, Mr. Lemmo held positions with General Electric Corporation and RCA.

Mr. Lemmo earned a BA in Psychology and Liberal Arts from Temple University in 1980, and a BSEE from Temple University in 1983. 

Scott A. McQuilkin - Chief Financial Officer

SCOTT A. MCQUILKIN is Chief Financial Officer of InterDigital, responsible for directing the organization's financial planning and accounting practices, leading merger and acquisition activities, and supporting the company’s capital markets efforts.

Mr. McQuilkin joined InterDigital in 2007 with over 25 years of senior-level experience in financial management with public and privately-held companies in the high-tech and financial services sectors. Prior to InterDigital, Mr. McQuilkin served as Chief Financial Officer for Metavante Lending Solutions, a high growth technology firm providing business process automation to the financial services industry. Mr. McQuilkin joined GHR Systems (which subsequently was acquired by Metavante Corporation), in 2000 as Chief Financial Officer and was responsible for finance, funding, acquisitions, accounting, strategy, human relations, facilities, and risk management. During his tenure, he led the company through a period of explosive growth and structured and negotiated several acquisitions. Prior to joining GHR Systems, Mr. McQuilkin served as Chief Financial Officer at De Lage Landen Financial Services and held senior finance positions at First Union Corporation.

Mr. McQuilkin earned a Master of Business Administration degree from The Wharton School in 1980 and a Bachelor of Science degree from Pennsylvania State University in 1976.

William C. Miller - Executive Vice President, Programs and Customer Support

WILLIAM C. MILLER is Executive Vice President of Programs and Customer Support of InterDigital. This organization is responsible for defining and meeting program plans and milestones, customer requirements and critical market windows for the company's technologies and products.

Mr. Miller joined InterDigital in July 2000 as Senior Vice President of Engineering and Programs from Telephonics Corporation, focusing on the management and performance of an international communications system integration program. Prior to that, Mr. Miller was Senior Program Manager for Norden Systems of Melville, NY, managing all activities associated with engineering development and integration. Mr. Miller is active in his Long Island, NY community where he founded and continues to serve as President of the Booster Club for the Northport High School track teams.

Mr. Miller earned a double Bachelor of Science degree in Marine Engineering and Transportation at the U.S. Merchant Marine Academy at Kings Point, NY in 1977, and a Masters degree in Business Administration at Long Island University in 1985. Subsequently, he has frequently taken Executive Development Programs from such institutions as Wharton Business School, University of Notre Dame's Mendoza School of Business and the Center for Creative Learning.

James J. Nolan - Executive Vice President, Engineering

JAMES J. NOLAN is Executive Vice President of Engineering of InterDigital, responsible for directing all system requirements and architecture, protocol software, ASIC/DSP, and platform integration and test activities.

Since joining InterDigital in 1996, Mr. Nolan has held a variety of engineering positions, most recently Vice President of Systems Engineering. He has led the technology and product development programs for modems, protocol software and radio designs for multiple wireless standards. He also played a key role in business development activities around the world. Mr. Nolan came to InterDigital from the Northrop Grumman Corporation where he held technical and leadership roles on various engineering development programs.

Mr. Nolan earned a BSEE from the State University of New York at Buffalo, an MSEE from Polytechnic University, and an Executive MBA from Hofstra University.

Janet M.  Point - Executive Vice President, Communications and Investor Relations

JANET M. POINT is Executive Vice President, Communications and Investor Relations of InterDigital, responsible for corporate communications, investor relations, and marketing. Ms. Point joined InterDigital in January of 2000 as Director of Investor Relations to manage and build the company's relationship with the institutional and individual investment community.

 Ms. Point's nearly 20 years of experience in investor relations spans large, mid- and small-cap companies. In addition to her investor relations work, she has served on various corporate committees including strategic planning, finance, communications and government relations. Her career includes five years as Vice President of Investor Relations for Advanta Corporation and five years in the investor relations group at Fannie Mae. A member of the National Investor Relations Institute (NIRI) since 1987, Ms. Point served six years on the Board of the Philadelphia Chapter of NIRI, including the President's role from 2002 through June of 2004.  Dedicated to her community, Ms. Point also serves on the Finance Council for the parish of Our Mother of Consolation.

Ms. Point received her MBA from the University of Michigan in 1983 and her BA in Economics and English from the University of Virginia in 1981.

Lawrence F. Shay - President, InterDigital’s Patent Holding Subsidiaries, EVP of Intellectual Property and Chief IP Counsel for InterDigital, Inc.

LAWRENCE F. SHAY is President of InterDigital’s Patent Holding Subsidiaries and is Executive Vice President of Intellectual Property and Chief IP Counsel for InterDigital, Inc.

Mr. Shay is responsible for overseeing all activities pertaining to InterDigital’s patent licensing business, including managing the company’s intellectual property assets, negotiating and administering license agreements, and supervising IPR-related litigations.  He joined InterDigital in November 2001 as Chief Legal Officer, bringing more than 18 years of legal and management experience.  He previously served as the General Counsel of a multi-national publicly-held professional services firm and from 1985 until 1999 Mr. Shay practiced corporate law with Dilworth Paxson LLP, a major Philadelphia law firm. Mr. Shay began his career in 1983 as an attorney working with U.S. District Court Judge Louis Bechtle in Philadelphia.  Mr. Shay has lectured on commercial transactions at the Temple University School of Law and he serves on the Board of Trustees of the Delaware County Memorial Hospital Foundation and various boards of the Crozer-Keystone Health System.

Mr. Shay earned his law degree, with honors, from the Temple University School of Law in 1983. He is a 1980 magna cum laude graduate of Saint Joseph's University, where he earned a Bachelor of Arts degree in Economics.

Steven W. Sprecher - General Counsel and Government Affairs Officer

STEVEN W. SPRECHER is General Counsel and Government Affairs Officer for InterDigital, Inc.
Mr. Sprecher is responsible for overseeing all activities pertaining to InterDigital’s legal and regulatory compliance issues and government relations activities.  He joined InterDigital in September 2007 as Deputy General Counsel, bringing more than 20 years of legal and management experience.  He previously served as the Vice President, Legal at Mindspeed Technologies (a spin-off of Conexant Systems). Prior to his role at Mindspeed, Mr. Sprecher was Of Counsel at Gibson, Dunn and & Crutcher LLP in Irvine, California for three years, managing corporate and securities issues for clients.  His previous eight years of experience include corporate and securities work both as inside counsel and as outside counsel. 

Mr. Sprecher earned his JD and MBA from UCLA in 1987 and his BS in Physics from the US Naval academy in 1977, graduating in the top third of his respective classes.   Mr. Sprecher served in the US Marine Corps from 1977 until 1983, receiving the Navy Achievement Medal in 1983 for superior performance.  During his military career, he completed his US Naval Air Training Command coursework and earned his designation as a fighter pilot.

Taking Breakthrough Wireless Technologies
from Invention to Implementation

step_01 Inventing Wireless Technologies
For over 30 years, we have developed digital cellular technologies to create innovative solutions yielding thousands of patents worldwide.
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step_02
 Contributing to Standards
We are key contributors to the cellular standards bodies from 2G, 3G and beyond, to wireless LAN and initiatives on mobility solutions for converged devices.
 
     
step_03 Licensing Patents
We are highly successful in licensing our patented technologies to leading manufacturers around the world. Our patents have generated over $1 billion in revenues.
  
     
step_04 Developing Products
We offer complete 2G/3G solutions.  We are developing complete 2G/3G modems by taking our validated solutions to silicon.  Our ASIC offering enables great synergy with our patent licensing program.
  

We have a unique and integrated process that drives our highly synergistic business model.  At InterDigital, everything starts with technology innovations, but we don’t just stop there.

Setting us apart is our ability to turn breakthrough thinking into practical solutions for the well-being of the industry and almost 3 billion users of wireless devices around the world. We contribute many of our innovations into the wireless standards, and our active involvement in the standards organization gives us valuable insight into the future needs of the industry. 

We offer product manufacturers licenses to our patent portfolio.  We are recognized and admired for our successful licensing program that enables many of the world’s leading wireless companies—a major part of our financial strength today.

Further, we commercialize our inventions—already validated through real-world simulations and testing—by offering advanced products and technologies to manufacturers of mobile devices. This full cycle— from technology inventions, to standards contributions, to patent licensing, and delivering products—is repeated with multiple technologies time and again. Our leading edge thinkers are working today on solutions for the next generations of wireless technologies.

About InterDigital

For over 30 years, InterDigital  has invented and developed advanced digital wireless technologies. These inventions—used in every digital cellular phone today— helped shape the wireless industry. Today, we remain at the cutting edge of tomorrow’s technology through ongoing research and development, contributing to the standards bodies, licensing our patented inventions to leading brands, and offering high-performance technologies and products.

Our Goal: Generate Revenue from Every 3G Device Shipped

Our strong financial performance is a tribute to the valuable technology we have developed over the years – and we continue to invest to maximize shareholder value. Entering the wireless chip market with dual mode baseband ASICs complements our successful patent licensing program and positions InterDigital to capitalize on the growth in the global wireless industry.

InterDigital has approximately 400 employees across its offices. The company is headquartered in King of Prussia, PA outside of Philadelphia, PA, with additional development centers in Melville, New York, and Montreal,  Quebec, Canada.

Publications & Presentations

DateTitle
11/01/2007Enhancing Wireless System Security with PHY Layer Techniques - Extended Abstract PDF
10/01/2007Joint Maximum Likelihood Estimation for Time and Frequency Synchronization PDF
06/01/2007On the Secrecy Capabilities of ITU Channels PDF
05/01/2007Carrier Frequency Offset Mitigation in a Proposed MIMO OFDM System PDF
04/20/2007Evolution of GSM into the Next Generation Wireless World PDF
04/09/2007Group Secret Key Generation Algorithms PDF
04/01/2007Seamless Mobility for IMS using IEEE 802.21 and SIP PDF
04/01/2007An Evolutionary Approach for Multi-Radio Access Technology (RAT) Mesh Converged Devices PDF
03/01/2007Uplink Single-User MIMO for 3GPP LTE PDF
02/28/2007Adding Seamless Mobility to LTE with Media Independent Handover PDF
10/01/2006Efficient Feedback Design for MIMO SC-FDMA Systems PDF

A Leading Contributor to Wireless Standards

Through its work with leading standards organizations, InterDigital has played a central role in defining global wireless standards for the industry. Most notable are the company’s many contributions to the principal 3G standards groups that are developing the specifications for future generation wireless communications technologies and products. Currently, hundreds of our technology contributions on WCDMA, HSDPA and HSUPA are included in today’s 3G specifications. InterDigital is also among the leading contributors to the standardization process for 3G LTE (Long Term Evolution) or 4G, 802.21 (seamless mobility), and other convergence solutions.

Leadership Positions Held

InterDigital has served, or is currently serving, in many important leadership positions in key industry standards initiatives. Included among these are:

  • Chair of the IEEE 802.16a Task Group (WiMAX Broadband Wireless Access, 2-11 GHz)
  • Chair of the IEEE 802.16e Task Group (WiMAX Mobile Broadband Wireless Access, based on the 2-11GHz IEEE 802.16a air interface)
  • Chair of the IEEE 802.16m Task Group (WiMAX 802.16 Advanced)
  • Vice Chair of the 3GPP RAN Working Group 3 (WG3)
  • Chair of ATIS WTSC Wireless Wideband Internet Access
  • North American Rapporteur for ITU-R IMT-2000 Deployment Handbook
  • Editor, 3GPP RAN WG1 Physical Layer Procedures (TDD)(R5)
  • Editor and Rapporteur, 3GPP RAN WG4, TDD Base Station Classification

Shaping The Industry

Many of InterDigital’s inventions opened the door to new paths in the wireless industry - in many important areas; its history is the history of the industry.

Setting the Framework for Today’s Digital Cellular Networks

InterDigital pioneered wireless TDMA digital voice technologies, setting the framework for mobile wireless digital voice systems, including GSM.  InterDigital was early to recognize the advantages of CDMA in wideband channels, which it called BCDMA. Since then, fundamentals of BCDMA have been adopted by WCDMA – “W” for Wideband as the de-facto 3G technology – becoming a “household” term around the world (at least within the industry).

Pushing for the Highest Data Rates Possible

Enter HSDPA and HSUPA (High Speed Downlink/Uplink Packet Access) – pushing 3G data speeds far beyond 2 Mbps.  InterDigital’s innovative advanced receiver achieves over 10 Mbps in downlink speeds and improves coverage, especially at the cell-edge.  Its HSUPA terminal design similarly pushes towards the highest data rate the network can handle.

Enabling Convergence through Seamless Mobility

Wireless terminals that can connect to a variety of networks - 3G, WiFi, WiMAX – are only just being introduced.  InterDigital is already offering solutions for interworking, seamless mobility, and contiguous mobile service today, known as 802.21.

Meeting the Needs of Tomorrow

The company’s sights are now set on wireless networks that provide tens to hundreds of megabits per second, with improved coverage and reliability. To some this is known as 4G, to others Long Term Evolution, requiring new advanced air interface technologies and all-IP networks throughout. 

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Trading Stocks on the Beach

All big achievements start with big dreams.  In the late 1960s, the company’s founder envisioned a communications system that would allow him to trade stocks while sitting on the beach — quite ambitious in a time when analog cellular phones were not yet available.  A few years later in 1972, the predecessor company to InterDigital was incorporated.

As the founder’s vision evolved, InterDigital has remained a pioneer in advancing the wireless industry - meeting challenges before others even recognize them. When the rest of the world was working on analog, we were developing digital. When everyone focused on voice, we were working on data. While others pursued narrowband, we were demonstrating broadband. And as most companies are just beginning to wonder where 3G, WiMAX and WiFi will go in the future, we are already delivering harmonizing solutions for seamless mobility between all standards. InterDigital - always a step ahead of the pack.