SlimModem Digital Baseband Core
The SlimModem Digital Baseband (DBB) Core is offered as a complete IP transfer package that includes a complete dual mode, 3GPP Release 6 compliant, 2G and 3G physical layer and optional dual mode protocol stack implementation.
Key Features:
- HSPA Category 10 (14.4 Mbps DL) and Category 6 (5.76 Mbps UL)
- Rx Diversity
- EGPRS (EDGE) multi-slot class 12 and DTM class 11/SAIC
- Single-die DBB targeted for 65nm CMOS technology
- DigRF Radio interface (DigRF version 3.09)
- Application Processor (AP) interface support
The SlimModem DBB Core IP is an upgrade to the market-proven SlimChip modem, which achieved PTCRB and GCF certification, including achieving 99.9% completion on ATT ADAPT certification program. InterDigital modem core IP is shipping in millions of devices, delivering best-in-class performance with industry leading data rates and receiver performance, in a small size, offering low power consumption and reduced costs.
InterDigital also provides comprehensive engineering support (including multiRAT handover) for the efficient integration into multimode 3G devices and LTE/WiMax products for the 4G market.
Technical Specifications:
Commercially Proven 2G Technology
- GSM, GPRS, EDGE physical layer and protocol stack software
- Commercially deployed in millions of 2G devices
- Market-proven receiver performance with Single Antenna Interference Cancellation (SAIC)
High Performance, Low-Power, Scalable 3G Physical Layer Solution
- Hardware-centric architecture optimized for power and performance
- High-performance rake receiver for R99 common and dedicated channels and R6 grant and indicator channels InterDigital Advanced Receiver for HSDPA delivers better link level performance than required by UMTS standards and higher system throughput
- Exceeds R6 performance requirements
- Type 1 (Rx diversity based)
- Type 2 (LMMSE based)
- Optional receive diversity increases performance
- Supports base station transmit diversity
- Proven and optimized architecture with small die size and low power consumption
- Integrated with GSM/GPRS/ EDGE baseband
R6 Dual Mode Protocol Stack with InterRAT
- Complete GSM/GPRS/EDGE and WCDMA/HSDPA/HSUPA dual mode protocol stack with InterRAT
- mature and proven 2G stack with best-in-class EDGE performance
- 3GPP R6 September 2007 compliant
- Hardware and Operating System independent implementation
- Seamless handover between GSM/ GPRS/ EDGE and UMTS modes
- Support for global roaming with USIM UICC
R6 Dual Mode Modem Specifications
- Compliant to 3GPP R6 September 2007 with support for 14.4 Mbps HSDPA and 5.7 Mbps HSUPA
- Class A Support (3GPP 22.060) for 2G (DTM) and 3G
- Multimode Type 2 UE (3GPP 21.910)
- Circuit switched data – up to 64 Kbps
- GSM/GPRS/UMTS R6 feature set
- UMTS tri-band – 2100/850/1900 MHz
- GSM quad-band – 850/900/ 1800/1900 MHz
- HR, FR, EFR, AMR voice codec support
- SMS, MMS
- GSM data and fax extensions
- GPRS multi-slot Class 12 support, coding schemes CS1 to CS4
- GPRS network modes I, II, III
- Integrated multiple PDP context support (IP with PPP)
- E-GPRS multi-slot, up to Class 12, coding schemes MCS 1-9
- Full E-GPRS uplink and downlink with incremental redundancy
Service and Support:
- Mobile broadband modem designs including RTL and software for both 2G (GSM/GPRS/EDGE) and 3G (R99/R4, HSDPA, and HSUPA)
- Algorithms and IP know-how
- Development platform and test tools
- Simulation results
- Application notes
- Engineering services for integration into customers’ platform or product
Standardized M2M Service Capabilities Layer Software and APIs
Thanks to advances in wireless communications, embedded systems, and IP networking, Machine-to-Machine (M2M) communications provide a huge opportunity for growth in M2M Service Applications. Future M2M Solutions are envisioned to connect billions of existing and new devices, ranging from high-end smart mobile terminals to low-cost resource-constrained wireless sensors or Radio Frequency Identification (RFID) tags. M2M technologies can be beneficially applied to a broad range of use cases for smart grid, telematics, eHealth/mHealth, vehicular networking and systems, industry control, home automation, and environmental monitoring.
Current M2M markets, however, are highly fragmented. Various vertical M2M solutions have been designed independently and separately for different applications, which inevitably impacts or even impedes large-scale M2M deployment. Today’s deployments also pose additional technical challenges in managing large amounts of disparate M2M devices, security guarantee, and service discovery.
The ETSI TC M2M standard can help accelerate the development and reuse of service layer solutions. This white paper illustrates how InterDigital’s suite of M2M solutions allow Solution Providers to capture the full potential of their M2M businesses.
InterDigital’s Standardized Machine-to-Machine Software Development Platform (M2MSDP) provides a standard M2M middleware solution with a common Application Programming Interface (API) for scalable and horizontal M2M services, featuring:
- Scalable Service Platform: Supports Server-to-Server, Gateway-to-Gateway, Device-to-Device peer communications and interactions to significantly improve scalability, reliability and security. Additionally, standards-based dIa/mId/mIa reference points are also supported;
Standardized End-to-End (E2E) Solution: Integrates all M2M entities from M2M Devices, M2M Gateways, to M2M Servers as an E2E and fully ETSI-compatible solution with Converged M2M Gateway to facilitate advanced local proxy and bulk management for massive devices behind the Converged M2M Gateway;
Service-Oriented Architecture: Supports peer Service Capabilities (SCs) for M2M Devices, M2M Gateways, and M2M Servers including, but not limited to, Application Enablement (AE), Generic Communications (GC), SECurity (SEC), Remote Entity Management (REM), and Interworking Proxy (IP). Advanced features include platform-agnostic and smooth binding with HyperText Transfer Protocol (HTTP) and Constrained Application Protocol (CoAP)
RESTful Architecture: Supports a Client/Server-based RESTful architecture and a hierarchical resource tree, simplifying and optimizing resource manipulations for a broad range of M2M Devices, especially constrained M2M Devices. Enables quick and efficient M2M application development;
Flexible Application API: Supports modular design and allows for use of different application protocols (CoAP, HTTP, etc) and different implementations (of these protocols) without rework.
Lightweight Device Management: Supports RESTFul and lightweight device management approach catering for M2M requirements, especially from constrained M2M Devices;
Automated Service Discovery: Significantly reduces management costs and automates the deployment process by removing human involvement and offline provisioning;
Autonomous Integrity Validation: supports policy-based M2M Devices and M2M Gateways integrity validation to improve reliability and dependability;
Going forward, InterDigital’s M2MSDP will incorporate context-aware design, collaborative and cognitive networking, and cloud-based services to smoothly evolve into future Internet-of-Things (IoT), facilitating global networking of connected devices in a RESTful and more efficient fashion.
Standardized M2M Software Development Platform
Preparing for the Next Frontier
InterDigital has been engaged with several leading technical universities for many years. Today, we maintain comprehensive and rewarding relationships with close to twenty prominent educational institutions across the United States, Canada, and Europe. Through a combination of internships, special project grants, memberships in their respective research centers, and sponsored studies, we gain exposure to relevant leading-edge academic research and tomorrow’s top engineering talent.

All trademarks are the sole property of their respective owners.
A Leading Contributor to Wireless Standards
Through its work with leading standards organizations, InterDigital has played a central role in defining global wireless standards for the industry. Most notable are the company’s many contributions to the principal wireless standards groups that are developing the specifications for future generation wireless communications technologies and products. Currently, hundreds of our technology contributions on WCDMA, HSDPA and HSUPA are included in today’s 3G mobile specifications. InterDigital is also among the leading contributors to the standardization process for LTE (Long Term Evolution) and LTE-Advanced, various IEEE 802 groups such as 802.21 (seamless mobility), and other convergence solutions, both wired and wireless.
Leadership Positions Held
InterDigital has served, or is currently serving, in many important leadership positions in key industry standards initiatives. Included among these are:
- Chair of the IEEE 802.16a Task Group (WiMAX Broadband Wireless Access, 2-11 GHz)
- Chair of the IEEE 802.16e Task Group (WiMAX Mobile Broadband Wireless Access, based on the 2-11GHz IEEE 802.16a air interface)
- Chair of the IEEE 802.16m Task Group (WiMAX 802.16 Advanced)
- Vice Chair of the 3GPP RAN Working Group 3 (WG3)
- Vice Chair of ATIS WTSC Radio Access Network (RAN) Subcommittee
- North American Rapporteur for ITU-R IMT-2000 Deployment Handbook
- Chair, IEEE 802.21b (Downlink Only Technologies)Task Group
- Editor, 3GPP RAN WG1 Physical Layer Procedures (TDD)(R5)
- Editor and Rapporteur, 3GPP RAN WG4, TDD Base Station Classification
On The Horizon
We have earned a reputation for solving some of the industry’s toughest technical challenges before others even recognize them. When the rest of the world was working on analog, we were developing digital. When everyone focused on voice, we were working on data. While others pursued narrowband, we were demonstrating broadband. And as most companies are just beginning to wonder where 3G, WiMAX and WiFi will go in the future, we are already delivering harmonizing solutions for seamless mobility between all standards.
LTE and Beyond
Modern wireless systems such as LTE, WiMAX, and WiFi continue to push forward with higher data rates, lower latency, and improvements in capacity and coverage. However, as the recent progress in OFDM, MIMO, Turbo coding, and other physical layer developments are starting to run out of steam, a range of promising new technologies will take wireless systems beyond today’s prevailing point-to-point systems. The drive for reliable mobile broadband communications requires an increased reliance on intelligent communications among multiple network elements, leading to further innovations in signal processing and coding. Radio spectrum around the world is increasingly being reallocated, thereby opening broad swatches of intermittently available frequencies, known as white space, for cognitive radio communications. This also brings about a new set of challenges as the selection and management of a particular frequency band shifts from the network to the terminals. We believe that this trend will continue leading to communication networks with increasingly decentralized and distributed control. Leveraging our ongoing efforts in seamless handover, we are exploring the protocols and architectures that make such networks operate efficiently, reliably and securely. Still at the conceptual stage, we are exploring the challenges posed by cloud computing, and how large numbers of autonomous nodes can continuously interoperate using machine-to-machine communications.
Collaborative Communications
Collaborative Communications is a fundamental premise for tomorrow’s wireless networking, whereby multiple base stations and mobile devices collaborate with each other – for example, through relay stations that function as additional helper nodes – maximizing overall network performance and delivering a uniform user experience.
In this environment, connections are dynamically routed across relay stations, other mobile devices, and base stations in neighboring cells to extend the range of coverage, fill coverage holes, improve in-building performance, mitigate interference at cell edges, and provide a more uniform user experience across the coverage region.
Seamless Connectivity
The growing demand for mobile broadband services is the catalyst for an ever-increasing variety of air interface technologies targeting local area to wide area connectivity. InterDigital envisions that the network of tomorrow will be a “Network of Networks” that enables uninterrupted services when roaming across many different independent radio access solutions – a mega network transparent to the users.
We have been a pioneer in the development of Media Independent Handover (MIH) and helped define the IEEE 802.21 standard for seamlessly connecting to GSM, WCDMA, WiMAX, WiFi, cdma2000, LTE, and virtually any other radio access technology. A typical MIH solution consists of a simple MIH client in the mobile device, an MIH server in the IP backhaul and requires no changes to the existing radio access network. Our seamless connectivity roadmap is rapidly evolving to enable additional services and capabilities that include IMS, Mobile TV, and Cognitive Radio.
- IMS: The IP Multimedia System, IMS, will be the dominant platform for delivery of wireless voice and data services. IMS is access technology independent and MIH provides a standardized solution to enable fast seamless vertical mobility for any multimedia service to enhance user satisfaction.
- Mobile TV: MIH can overcome the inherent limited coverage of current Mobile TV technologies (DVB, DMB, MediaFLOTM, etc.) by enabling seamless handover to other wireless technologies, such as cellular, WiFi or WiMAX, for uninterrupted service.
- Cognitive Radio: Looking further in the future, cognitive radio technology promises to use the flexibility of a smart terminal to adapt both the radio and network configuration to, for example, better utilize spectral white space. In such a scenario, MIH-like technologies can provide central database access and also deliver the protocol for dynamic bids initiated by either the user or the operator on available spectrum in a given location.
Wireless Security
Today’s sophisticated wireless devices increasingly hold more personal data and can perform sensitive transactions, requiring additional levels of security and integrity before mobile commerce can further flourish. InterDigital is on the leading edge of inventing unique enhanced security methods that will protect the data and software in wireless networks and mobile devices from misuse, tampering, malware, and other unauthorized access.
Focusing on security beyond data encryption, we exploit the unique and random characteristics of wireless channels to generate secure unbreakable keys and identify authorized users. Recognizing the trend toward the large, highly-connected Internet of Things, we propose a trusted communications environment that utilizes practical techniques to assess the health of network nodes and effectively combat malicious attacks.
- Physical Layer Fingerprinting: For every wireless connection the channel characteristics are unique, effectively creating a one-of-a-kind fingerprint that can be used to identify and reject malicious users and protect the network against certain types of wireless attacks.
- AirKeys: The wireless channel provides a shared, time varying, common secret handshake between any two communicating terminals. As the name implies, AirKeys denotes a proven practical technique to dynamically generate unbreakable secret keys by extracting common features from physical channel measurements. Any two parties no longer need to pre-share a secret key to secure communications between them.
- TrustShield: TrustShield technology enables trusted wireless network connectivity by verifying a node’s trustworthiness through a process that is analogous to performing a health check. This capability starts by including a trusted processing engine that can recognize unmodified states of the device in a highly secure way. A communicating device or node is given a clean bill of health when the embedded trusted engine indicates a safe state, free of viruses, tampering, or other malware. Devices that are not assigned a clean bill of health can be categorized as potentially untrustworthy and given limited access to the network. The verification process can be repeated frequently and can support several layers, providing various communication activities and levels of protection.
More Efficient Wireless Networks, a Richer Multimedia Experience, and New Mobile Broadband Capabilities
As we continue to leapfrog the industry, we are working on advanced solutions that will support more efficient wireless networks, a richer multimedia experience, and new mobile broadband capabilities for decades to come, including:
Next Generation Cellular
Advanced network topologies and spectrally-efficient air interface solutions for LTEAdvanced and beyond.
Fuzzy Cells Technology White Paper
Bandwidth Aggregation
Cognitive radio techniques for aggregating multiple heterogeneous bandwidth sources.
Media Mobility
Intelligent data optimization and seamless multimedia transfers across devices and networks.
Machine-to-Machine Connectivity
Architectures for M2M ubiquity and converged gateway.
The Bandwidth Solution
In anticipation of the significant bandwidth demands being placed on wireless networks by smartphones, netbooks, tablets and the like, we have been developing advanced solutions that address the emerging network congestion issues, the industry’s biggest challenge going forward.
With the popularity of smartphones and the proliferation of multimedia applications, virtually all industry observers are predicting exponential growth in data traffic. We have seen analyst estimates range widely from a 10x to a 66x increase of wireless data traffic by 2014 – vastly surpassing the requirements for voice calling and text messaging. Regulators and operators around the world are scrambling to mitigate the imminent bandwidth deficit by trying to allocate more wireless spectrum and to create new ways to manage that precious resource. But simply adding more spectrum is only part of the solution. Spectrum is a limited resource, deployments could take years to implement, and, even with the new air interface technologies, the systems won’t be sustainable in the long run.
For several years already, InterDigital has been developing a range of holistic solutions to address the wireless bandwidth crunch and network congestion. We are focused on three comprehensive areas of bandwidth innovations: spectrum optimization, cross-network connectivity and mobility, and intelligent data delivery techniques. In simpler terms, you can think of it as bigger pipes, more pipes, and better pipes.
Network of Networks
The next generation in wireless will be characterized by the seamless integration of multiple communications networks, which include other air interfaces, that intelligently and constantly connect people and things across a myriad of wide, local, and personal area networks.
Traditional networks were designed to connect people to people. Today, we are seeing the beginnings of people connecting to things and machine-to-machine communications, resulting in a dramatic expansion of data connections per person and the rapid rise of new industry players. However, the pieces are still highly complex, unorganized and disconnected.
Enabling a world that is seamlessly connected and fully integrated, with billions of subscribers and trillions of connections, represents a huge opportunity for innovations across several key areas:
- Dependable connections for everyone, everything, everywhere
- Ultra-broadband, low latency, high capacity, and reliable coverage for limitless applications, and flexible bandwidth management
- QoS flexibility, balancing high throughput with low power, low cost, and small size, subject to application needs
- Security and privacy, preventing misuse, tampering, malware, other unauthorized access, and intelligent data routing
- Making it work together, transparent and seamless to the user, regardless of network technologies, and with a sound business case for all players in the value chain.
InterDigital’s research team continues to focus on solving the toughest technical problems in wireless. That’s what we do best. We are widely recognized for our work in fundamental wireless system architectures and known as pioneers in wireless resource management, network robustness, and interference mitigation – key attributes that will be even more critical tomorrow.
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Corporate Governance
Corporate Governance
Corporate Governance
History
In the late 1960s, the company’s founder, Sherwin Seligsohn, envisioned a communications system that would allow him to trade stocks while sitting on the beach — quite ambitious in a time when analog cellular phones were not yet available. A few years later in 1972, International Mobile Machines Corporation - the predecessor company to InterDigital - was incorporated in Philadelphia, Pennsylvania.
In the late 1970s, before digital cellular networks were introduced in the U.S., InterDigital started to develop TDMA – Time Division Multiple Access – technology for use in digital wireless telephone systems. Its engineers, experts in RF Engineering, were driven by the dream of developing new technology that would allow people to communicate more effectively. InterDigital’s founder envisioned this technology as being spread throughout the world in one huge network.
During these early days, the company recognized that the breakthrough technologies it had developed had great potential, but were well-ahead of mass-market adoption and commercialization. Being a very small company at that time, InterDigital was not in a position to create a market by itself and decided to secure its interests by patenting its inventions. InterDigital had its IPO in 1981, which provided the necessary funding to expand into product development.
In the mid 1980s, InterDigital developed UltraPhone®, a wireless local loop system. First installed in the U.S., orders quickly followed from Mexico, Indonesia, Philippines, and other countries where wireline telephone service did not exist – eventually selling 345 systems.
By the early 1990s, the telecommunications industry in the U.S., quite familiar now with digital cellular networks, was divided into two camps – TDMA and CDMA. InterDigital at this time was known as the “TDMA Company” and TDMA was the dominant of the two technologies with support from most of the Regional Bell Operating Companies (RBOCs) and AT&T.
In 1992, through a strategic acquisition of SCS Mobilecom/Telecom, a small private company with Spread Spectrum CDMA technology, InterDigital became one of only a few companies in the industry with expertise in both TDMA and CDMA technologies. This milestone event boosted the company’s technical expertise and positioned it to move into product development. Not long after, InterDigital demonstrated its Broadband Code Division Multiple Access™ (B-CDMA) technology, transmitting voice and data at ISDN rates from a subscriber unit traveling in an automobile at its technology development center in Melville, NY.
Widely recognized as the forerunner of today’s WCDMA technology, this was an important early step toward delivering simultaneous high speed data transmission, wireline quality voice and multimedia applications - including video conferencing. While this initial B-CDMA technology was designed for the wireless local loop market, InterDigital continued the development of broadband technologies recognizing their potential for third generation solutions being contemplated across the world at that time.
InterDigital became a key contributor to the leading standards bodies with innovations in more efficient algorithms for faster data speeds, increased network capacity, improved battery life, etc. Having been one of the architects of 2G/2.5G technologies, the company also became a major player in 3G with its inventions in WCDMA (Wideband CDMA).
By the end of the decade, InterDigital had built a successful patent licensing program, having licensing agreements in place with many of the world’s leading manufacturers of mobile phones. Its 3G technology programs also received accolades from across the industry, resulting in collaborative development agreements with Nokia and Infineon.
Around the turn of the millennium, InterDigital became active in the evolution of 3G with HSDPA (High Speed Download Packet Access) and HSUPA (High Speed Upload Packet Access) breakthroughs enabling true wireless broadband with data speeds over 10 Mbps for mobile computing, multimedia, gaming and commerce - forever changing the paradigm of mobile “telephony”. By 2006, the company’s patent licensing program had generated over one billion dollars and the company embarked on the development of its own high-performance dual mode modem ASIC with HSDPA and HSUPA, targeting data-centric devices.
Today, InterDigital continues to be extremely active in the standards process – both in the U.S. and internationally - contributing its ideas and intellectual property along with other companies in shaping the evolution of the wireless industry.
Stock FAQ
I hold a stock certificate for International Mobile Machines (or InterDigital Communications Corporation). How do I change it to InterDigital, Inc.?
It is not necessary to change an International Mobile Machines or an InterDigital Communications Corporation stock certificate to an InterDigital, Inc. certificate. All outstanding shares of either entity were converted automatically into shares of InterDigital, Inc. on a share-for-share basis. If you would like to change your certificate, contact our Transfer Agent, American Stock and Transfer at +1 800 937 5449 or visit www.amstock.com.
How do I make changes to my InterDigital account?
If you purchased your shares through a broker, your shares are held in Street name. You need to contact that broker to make changes to your account. If you have your stock certificate, you are a Shareholder of Record. You may contact InterDigital's transfer agent, American Stock Transfer & Trust, at +1 800 937 5449 or visit www.amstock.com. Be sure to inform the transfer agent if you have a change of address.
What is the CUSIP for InterDigital's Common Stock?
InterDigital's Common Stock CUSIP number is 45867 G 101.
Does InterDigital pay a dividend?
InterDigital has not paid cash dividends on its common stock since inception. It is anticipated that in the foreseeable future, without regard to any cash proceeds the company may receive from any settlement or resolution of outstanding arbitrations or litigations, no cash dividends will be paid on the common stock. Any cash otherwise available for such dividends will be reinvested in the company's business or used to repurchase common stock. When considering whether or not to pay cash dividends, InterDigital's Board of Directors assesses earnings, any dividend requirements on Preferred Stock if issued in the future, capital requirements and other relevant factors.
When was InterDigital's initial public offering and what was the opening price?
InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 at an initial price of $3.00 per share.
Did InterDigital’s stock trade under any symbols other than IDCC?
InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 and the company’s Common Stock began trading on the NASDAQ Global Select Market system under the ticker symbol IMMC. On May 26, 1992, company’s Common stock began trading on the American Stock Exchange under the ticker symbol IMM. In 1992, the company changed its name to InterDigital Communications Corporation and on October 19, 1992, the company’s ticker symbol changed to IDC. On April 26, 2000, the company's Common Stock began trading on the NASDAQ Market under the symbol IDCC.
On July 2, 2007, InterDigital Communications Corporation, the company’s predecessor, filed a Form 8-K announcing an internal corporate restructuring, which resulted in InterDigital, Inc. being substituted as the publicly-traded company. To indicate this substitution event, NASDAQ implemented a 20-trading day transition period on July 9, 2007, temporarily changing the company’s trading symbol from “IDCC” to “IDCCD.” Beginning at market open on August 6, 2007, InterDigital, Inc.’s common stock trades on the NASDAQ Global Select Market under the ticker symbol “IDCC.”
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Legal Notices
COPYRIGHT. All contents of this site such as text, graphics, images, audio clips and data compilations are the property of InterDigital, Inc. or its content suppliers and are protected by copyright law. No portion of the information on this web site may be copied or reproduced in any form, or by any means without prior written permission from InterDigital. Visitors to this site are not permitted to modify, distribute, publish, post, transmit or create derivative works of any material found on this site for any commercial or non-private purposes.
TRADEMARKS. The trademarks, service marks and logos displayed on InterDigital’s web site are the property of InterDigital, Inc. or third parties. Visitors to this site are not permitted to use these marks without the prior written consent of InterDigital (or the third party which may own the mark).
DISCLAIMER. ALL INFORMATION PROVIDED ON THIS WEB SITE IS PROVIDED "AS IS," WITHOUT WARRANTY OF ANY KIND, EXPRESSED OR IMPLIED. InterDigital assumes no responsibility for the accuracy or completeness of the information and may change the contents at any time without notice.
About the Industry
Today, it would be hard to imagine a world without mobile phones. Wireless technologies have changed the way we work, live, and play. By typical measures, the wireless market would be considered mature, but the reality is that the wireless industry is changing faster than ever before, with new technologies, products, applications, and services being introduced daily. As technologies, content, and devices blossom, the only limit on the opportunity for InterDigital is our imagination. Useful Resources:WiFi Alliance |
Technical Publications
| Developing FPGA-Based Sensing Algorithms to Harvest TV White Space and Other Underutilized Spectrum | 886 KB |
Industry Events
Mobile World Congress
February 27 - March 1, 2012
Barcelona, Spain
International CES
January 10-13, 2012
Las Vegas, NV
Broadband Traffic Management
November 15-17, 2011
London, UK
Mobile Network Optimization
November 2–3, 2011
Amsterdam, NL
4G World 2011
October 24-27, 2011
Chicago, IL
CommNexus Special Interest Group
October 11, 2011
San Diego, CA
Webinar: Is On-Loading the New Off-Loading?
October 6, 2011
11:00 a.m. ET
Webinar Presentation
GIGAOM Mobilize
September 26-27, 2011
San Francisco, CA
26th ASEI National Convention
September 24, 2011
Fullerton, CA
eComm 2011
June 27-29, 2011
San Francisco, CA
eComm 2011 Presentation
Femtocells World Summit 2011
June 21-23, 2011
London, UK
LTE World Summit
May 17-18, 2011
Amsterdam, The Netherlands
International CTIA Wireless 2011
March 22-24, 2011
Orlando, Florida
Mobile World Congress
February 15-18, 2011
Barcelona, Spain
Innovation Alliance Conference
January 21, 2011
Washington, DC
Innovation Alliance Conference Invitation
2011 International CES
January 6-9, 2011
Las Vegas, Nevada
Customer Support
Contact:
Tel: +1-631-622-4132
Product Documentation/Updates:
To get product documentation/updates, click here.
Submit Product Issues/Questions on Existing Product:
To submit product issues/questions on existing product, click here.
Corporate Governance
We are constantly seeking to build an organization that will drive substantial shareholder value. In doing so, we are committed to a well-defined and broadly communicated corporate governance policy that will protect our shareholders’ interests. An experienced and majority-independent board of directors with entirely independent committees provides the oversight function, which is a central element in sound corporate governance. In 2003, we codified our corporate governance guidelines and established a mechanism for shareholder communication with the Board of Directors.
Investors are invited to learn more about InterDigital’s corporate governance guidelines--as well as information on Board members, committees and committee charters, by-laws, and InterDigital’s code of business conduct and ethics.
Analyst Coverage
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SEC Filings
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Annual Reports
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Events / Presentations
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Stock Facts
| Q. | I hold a stock certificate for International Mobile Machines. How do I change it to InterDigital Communications Corporation? |
| A. | It is not necessary to change an International Mobile Machines stock certificate to an InterDigital Communications Corporation stock certificate. If you would like to change the certificates, contact our Transfer Agent at +1 800 937 5449 or visit www.amstock.com. |
| Q. | How do I make changes to my InterDigital Communications Corporation account? |
| A. | If you purchased your shares through a broker, your shares are held in Street name. You need to contact that broker to make changes to your account. If you have your stock certificate, you are a Shareholder of Record. You may contact InterDigital’s transfer agent, American Stock Transfer & Trust, at +1 800 937 5449 or visit www.amstock.com. Be sure to inform the transfer agent if you have a change of address. |
| Q. | What is the CUSIP for InterDigital’s Common Stock? |
| A. | InterDigital’s Common Stock CUSIP number is 45866A105. |
| Q. | Does InterDigital pay a dividend? |
| A. | InterDigital’s Common Stock does not pay a dividend. |
| Q. | When was InterDigital’s initial public offering and what was the opening price? |
| A. | InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 at an initial price of $3.00 per share. |
| Q. | Did InterDigital’s stock trade under any symbols other than IDCC? |
| A. | InterDigital went public (as International Mobile Machines Corporation) on November 12, 1981 and the Company’s Common Stock began trading on the Nasdaq Global Select Market system under the ticker symbol IMMC. On May 26, 1992, Company’s Common stock began trading on the American Stock Exchange under the ticker symbol IMM. In 1992, the Company changed its name to InterDigital Communications Corporation and on October 19, 1992, the Company’s ticker symbol changed to IDC. On April 26, 2000, the Company’s Common Stock began trading on the Nasdaq Global Select Market under the symbol IDCC. |
Investor Relations
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Press Releases
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Press Center
InterDigital’s management and key personnel are available to share their insights into most aspects
of the wireless industry. We invite members from the press and industry analysts to contact us on
topics relating to the following items:
- The evolution of the wireless industry, technologies and markets
- The wireless standardization process
- Innovation, intellectual property rights and technology and patent licensing
The Faces of InterDigital
![]() | We embrace the unique backgrounds, perspectives, and creativity of our diverse work force. Our employees thrive in this open, challenging, and rewarding work environment. |
Gregg Charlton graduated with a BSEE from Carnegie Mellon University and later earned his MSEE. at the University of Michigan.
Afshin Haghighat earned his Masters of Science Degree and Ph.D. from Concordia University.
Micheline Liberatore received a D.E.C. from Dawson College, Montreal..
John McNally holds a Bachelor’s Degree in Engineering Science from Stony Brook University, and earned his MBA from Dowling College.
Meridith Novara holds a Bachelor’s Degree in Business Administration from New York Institute of Technology.
Yi Zhang holds a Bachelor’s Degree in Finance Management from Wuhan University, and attended the University of Colorado where she earned her Masters in Accounting.
Working at InterDigital
We promote a balanced lifestyle, where reaching your professional and personal goals are equally important. In addition to our generous compensation and benefits plans, we foster an environment where company-sponsored activities for employees and their families and recreational events are offered and giving back to our local communities is strongly encouraged. | ![]() |
Community Involvement
InterDigital believes that a company is also a community. In addition to celebrating company and personal successes, we place a high value on sharing our time and resources with those less fortunate. We sponsor company initiatives involving local organizations as well as contributing to a range of global/local charitable efforts.
Fun at Work
We believe in the old adage: “work hard, play hard.” In addition to our annual company sponsored events, we have a very active Recreation Committee that organizes activities throughout the year, promoting a healthy dose of fun, camaraderie and a bit of stress relief to boot!
Where We Live, Work, and Play
If you are contemplating joining our exciting team, all of our facilities are located in vibrant communities offering ample housing, excellent schools, and a variety of shopping and entertainment options.
- King of Prussia, a thriving western suburb of Philadelphia, Pennsylvania
- Melville, close proximity to New York City and the quaint beaches of Long Island, New York
- Montreal, a dynamic cosmopolitan Canadian city, rich in culture and tradition
- San Diego, this booming wireless innovation hub on the Pacific Ocean offers the very best in Southern California living
Career Opportunities
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Highly Competitive Compensation & Benefits
InterDigital provides a comprehensive compensation and benefits package, including:
- Competitive, Market-Driven Base Salaries
- Short and Long Term Cash and Equity-based Bonus/Incentive Compensation Plans
- Profit Sharing
- 401k Plan with Company Match
- Company-Paid Holidays
- Paid Time Off (Starting at 18 Days Annual Accrual)
- Health Benefits, including Medical, Dental, Vision and Prescription Drug Program
- Short and Long Term Disability Plans
- Life Insurance and AD&D Plans
- Flexible Spending Accounts (Medical and Dependent Care)
- 529 College Savings Plan
- Employee Referral Program
- Tuition Reimbursement and Company-sponsored Training Curriculum
- Employee Assistance Program
- Credit Union
- Direct Deposit
- Fitness and Wellness Programs (some facilities have on-site fitness centers)
Passionate About Shaping the Future?
Our innovations, technology breakthroughs, and commercial successes are grounded on having the brightest, most talented, and most dedicated individuals in the industry. Our employees are clearly an enormous asset. Our pioneering legacy, technical abilities, and strong patent holdings are admired by both our customers and competitors around the world.
InterDigital strives to foster a diverse and stimulating environment where creative, intelligent, and ambitious people can achieve their professional and personal goals. At InterDigital, we support an entrepreneurial culture with solid resources, structure and stability to make a big impact on the future of wireless communications. Everyone contributes directly to the company’s strategic goals and bottom line – hands-on using a team-oriented approach.
InterDigital has a wide variety of exciting career opportunities for skilled professionals, and an environment that supports innovation and excellence. InterDigital is an equal opportunity employer supporting diversity in the workplace.
Join InterDigital and put your fingerprints on the future of wireless.
Contact
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| Investor RelationsJanet Meenehan Point Media RelationsPatrick Van de Wille Technology & ProductsAdrian Bishop PatentsPatent Licensing Email: patentlicensing@interdigital.com Patent Acquisitions Email: patentacquisitions@interdigital.com WebmasterEmail: Webmaster@interdigital.com
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Global Licensing Expertise
Among InterDigital’s licensees are many of the world’s leading brands and manufacturers. Throughout our history, we have established patent license agreements covering one or more standards with almost 40 manufacturers of wireless equipment including:
- Apple
- LG
- NEC
- Sharp
- Research in Motion
- Ericsson
- High Tech Computer
- Nokia
- Samsung
- Sony-Ericsson
Our patent licensing organization can guide you through the complex landscape of global standards and tailor a program to your company’s specific needs.
Fundamental Breakthroughs
Below is a sampling of key technologies covered by our patent portfolio:
Seamless Handover
Increases coverage, accommodates more users and saves battery life.
Joint Detection and Interference Cancellation
Cancels out extraneous noise for a clearer and crisper reception.
Fundamental System Architecture
InterDigital developed the basic design concepts and methodologies by which most commercial TDMA and CDMA wireless systems are implemented worldwide.
Bandwidth on Demand
Enables systems to allocate bandwidth in an extremely efficient manner, increasing the capacity of a wireless system.
Power Control
Superior power control technology to maximize system capacity and minimize signal interference and degradation.
Packet Data
An extremely efficient method of transporting packet data over a radio signal, thereby increasing radio system capacity.
Global Pilot Channel
A reference signal transmitted by the base station that allows reliable and robust communications by all mobile users.
A listing of InterDigital’s US patents can be found on the US Patent and Trademark Office website.
Our Inventions Lie at the Heart of
Wireless Communications
Our know-how and inventions reach across virtually all mobile and wireless devices. InterDigital holds approximately 8,800 U.S. and foreign issued patents combined. In addition, we have almost 10,000 patent applications in process around the world. Our success in increasing the pace and breadth of our innovation business reflects our fundamental commitment to remain an industry leader in the creation of pioneering wireless technologies. We have a comprehensive program of developing and protecting our intellectual property through the worldwide filing and issuance of our patents.
InterDigital’s licensing practices are considered exemplary by licensing and industry experts. In 2006, in recognition of our licensing program success, InterDigital received the prestigious Licensing Achievement Award from the Licensing Executives Society. The company is also a founding member of the Innovation Alliance- a coalition of entrepreneurial companies seeking to enhance America’s innovation environment by improving the quality of patents granted and protecting the integrity of the U.S. patent system.
Enabling the Wireless Ecosystem
Leveraging over 35 years of wireless technology and product development experience, InterDigital offers advanced enabling solutions and products to established and emerging companies across the broadening domain of converged devices, networks, and services worldwide.
Our advanced multimode modem cores and mobility middleware are configured for easy integration, ensuring shorter time-to-market. Today, our embedded technology is shipping in millions of units all over the world.
With an eye on the future, InterDigital extends an invitation to fellow global market participants in the wireless ecosystem to collaborate on integrating our advanced technologies into products and services for field testing and commercial deployment.
Customers, Licensees and Strategic Relationships
Throughout our history, InterDigital has been on the forefront of wireless innovations around the world. The company’s business relationships, patent licenses, and product and technology deployments reach across the globe.
Here is a sampling of InterDigital’s customers, licensees and strategic relatonships that are among the world’s most successful companies and popular brands today:

InterDigital Technical Advisory Council
InterDigital’s Technical Advisory Council, formed in 2010, advises the company’s senior management team on strategic technical priorities and direction, potential new markets and product opportunities, product, service and technology program initiatives, and additional technology matters where the Council brings relevant insights.
Council Members include:
Thomas Gilley joined InterDigital’s Technical Advisory Council in 2010. Mr. Gilley, a technology entrepreneur with a broad range of experience and success in social computing, modern media and mobile technologies, serves as the Chief Technology Officer at Critical Media, a broadcast media intelligence company in New York.
Throughout his career, Mr. Gilley founded several successful companies including: Vidavee, an on-demand web media company acquired by Vignette, Meeting Technologies, a social computing company, FutureTel, the first MPEG video broadcast equipment company and PicoStar, an incubator and technology investment company. He was CTO at Vignette and held R&D and product management positions with Apple Computer and was a strategy consultant with Compass Advisers.
Dr. Andrea Goldsmith joined InterDigital’s Technical Advisory Council in June 2010. Dr. Goldsmith is a professor of Electrical Engineering at Stanford University. She is also a Fellow of the IEEE and Stanford University, current officer of the IEEE Information Theory Society and editor for the Journal on Foundations and Trends in Communications and Information Theory and in Networks.
Dr. Goldsmith is a Distinguished Lecturer for the IEEE Communications Society and has received several awards for her research on wireless information and communication theory, MIMO systems and multihop networks, cognitive radios, sensor networks, cross-layer wireless system design, wireless communications for distributed control, and communications for biomedical applications. Additionally, she is author of the book "Wireless Communications" and co-author of the book "MIMO Wireless Communications."
Previously, Dr. Goldsmith was an assistant professor of Electrical Engineering at Caltech and has held industry positions at Maxim Technologies, Memorylink Corporation, and AT&T Bell Laboratories. She founded Quantenna Communications Inc., a leading developer of Full-11n™ wireless networking solutions.
Dr. Goldsmith received her B.S., M.S. and Ph.D. degrees in Electrical Engineering at the University of California at Berkeley.
David A. Hytha joined InterDigital’s Technical Advisory Council in 2010. A wireless executive and entrepreneur advising leading-edge firms in wireless communications, Mr. Hytha serves as General Partner at New Wave and Executive-in-Residence at Sofinnova Ventures, a major venture capital firm. Additionally, he serves as a member of the Board of Directors of several private and public companies including Option, Ltd. of Belgium.
Previously, Mr. Hytha served as Executive Vice President, Terminals for T-Mobile, responsible for the selection, marketing and development of all handsets for T-Mobile in Europe. He held leadership roles with Silicon Wave (now part of Qualcomm), LGC Wireless (now part of ADC), Motorola, McCaw Cellular (now AT&T Wireless), AT&T Network Systems (now Alcatel-Lucent) and AT&T Microelectronics (now LSI Logic/Infineon), including founding the first overseas department of Bell Laboratories.
Mr. Hytha holds an MBA from Columbia University in New York and a BA from the College of the Holy Cross.
Dr. Luigi Licciardi joined InterDigital’s Technical Advisory Council in 2010. Throughout his career in telecommunications, Dr. Licciardi held leadership positions in engineering, strategic planning, and market development. He currently serves as Head of Technology Plan and Standard Coordination in Technology and Operations with Telecom Italia, Italy. Previously, as Executive Vice President in Domestic Mobile Services, Dr. Licciardi’s responsibilities included Mobile Industries Relations and Head of handset and Technical Solutions in Telecom Italia Marketing. He served on the Board of directors of OMTP (Open Mobile Terminal platform) and LIPS, representing TIM.
More recently, his involvements include the launch of new mobile technologies such as HSPA, DVB-H, and 3D Gaming. His focus areas include: Femtocells, LTE, Mobile BB, Convergent Network solutions, Mobile Backhauling, M2M, GPON, IPTV, Connected Home, M-advertising, M-payment and money transfer, proximity technologies, advanced handsets.
Dr. Licciardi received his degree in Electronic Engineering from Politecnico di Torino, Italy. He is the author of several papers and publications on VLSI circuit design, Packet switching, access networking, terminals and new enabling technologies for ICT applications and is named as inventor in several patents in these areas.
Dr. Byung K. Yi (“B. K.”) joined InterDigital’s Technical Advisory Council in 2010. Dr. Yi retired from LG Electronics in January 2012 after serving the company twelve years as a Senior Executive Vice President during which time he established and headed the LGE North America R&D center, developing mobile terminals for North American carriers. Through his career, Dr. Yi has managed research and development programs across most cellular technologies and has held leadership positions on several standards bodies—most notably, he has been elected TSG-C chairman for two two-year terms developing 3GPP2 air-interface specifications. Dr. Yi also has extensive expertise in many facets of satellite and space communications system engineering.
Dr. Yi serves as a Steering Board of WWRF (World Wireless Research Forum), NGMC (Next Generation Mobile Communication) Forum, UK-Korea Technology Forum and is on the Industrial Advisory Board (IAB) of the WCET (Wireless Communication Engineering Technology) Certification Program of IEEE Comsoc. He also serves as a board member of the CWC (Center for Wireless Communication) at the University of California, San Diego, TIA (Telecommunication Industry Associations), and CDG (CDMA Development Group). Dr. Yi was an adjunct professor at the George Washington University from 1992 through 2000, and holds ten U.S. patents and 16 international patents in the areas of iterative decoding and handoff schemes of the cellular based system. His “the softest Handoff” patent has been cited and referenced 65 times. His current interests are wireless and space communication systems, M2M, mobile health, new MPEG codec, iterative decoding, and space system engineering. .
Naresh Soni is responsible for InterDigital’s technology strategy and roadmap, university and industry relationships, and providing guidance on merger and acquisition opportunities as well as new research and development initiatives. Mr. Soni joined the company as Vice President of Strategic Engineering in July 2009. Prior to InterDigital, Naresh founded Exemplar Technologies, a consulting firm that provides innovative services and product development strategies to clients. Previously, he served as chief technology officer for Streamezzo, a venture-funded provider of interactive rich media solutions for some of the world’s leading handset manufacturers and wireless operators. Mr. Soni’s previous experience includes research and innovation-focused positions at STMicroelectronics, AT&T Bell Labs, and IBM, as well as the position of vice president of Computing Architecture Research Lab at Nokia.
Mr. Soni holds several patents, has authored technical papers and has given keynotes at conferences in the areas of communications and computing. Mr. Soni earned his Master of Science in Computer Engineering from the University of Texas, Austin, and Bachelor of Science in Electrical Engineering from the University of Mumbai. Naresh has served on the board of University of California San Diego (UCSD) Center for Wireless Communications and is currently on the advisory board of the UCSD school of Electrical and Computer Engineering.
Committed to Building Shareholder Value
Comprised of senior executives with broad industry experience, the InterDigital leadership team is committed to delivering shareholder value. Proud of the company’s market success to date, the group continues to support strong investments in business opportunities in the wireless sector.
Board of Directors
STEVEN T. (“TERRY”) CLONTZ joined InterDigital’s Board of Directors in April 1998 and was elected Chairman of the Board in January 2010. Mr. Clontz, a veteran in the global telecommunications industry for almost 40 years, joined Singapore Technologies Telemedia, a Singapore-based investor/operator in the telecommunications and media sectors, in January 2010 as Senior Executive Vice President for North America and Europe. From January 1999 through his retirement in 2009, Mr. Clontz served as President and Chief Executive Officer of StarHub, a Singapore-based telecommunications and media company providing a full range of services over fixed, mobile, and cable TV networks. He continues to serve as a non-executive director of StarHub.
Prior to joining StarHub, Mr. Clontz served as President and Chief Executive Officer and an executive Director of IPC Information Systems, a provider of financial trading communications solutions, from 1995 through 1998. Mr. Clontz began his career as an engineer with Southern Bell in 1973. He joined BellSouth International in 1987 and served as President of its Asia Pacific Region from 1992 through 1995.
Mr. Clontz has served on the Boards of Directors of Equinix, a leading global provider of network-neutral data centers and Internet exchange services, since April 2005 and Level 3 Communications, an international provider of fiber-based communications services, since April 2012.
Mr. Clontz earned his bachelor’s degree in physics at the University of North Carolina at Greensboro.
DR. GILBERT ("GIL") F. AMELIO joined InterDigital’s Board of Directors in March 2011. Dr. Amelio was a Senior Partner at Sienna Ventures, a privately-held venture capital firm, from 2001 through December 2011. He also serves on the boards of directors of AT&T and Galectin Therapeutics (formerly Pro-Pharmaceuticals).
Dr. Amelio’s career spans decades of executive leadership roles in leading technology companies including Apple, National Semiconductor and Rockwell International. His leadership roles include Chief Executive Officer and Chairman of Apple Computer, President, Chief Executive Officer and Chairman of National Semiconductor, and President of Rockwell Communication Systems, a unit of Rockwell International. He was founder, Chairman and Chief Executive Officer of Acquicor Technology, Inc., as the company merged to become Jazz Technologies.
Dr. Amelio is a pioneer in the U.S. technology industry, having started his career at AT&T Bell Laboratories and Fairchild Semiconductor. A former director and chairman of the Semiconductor Industry Association, Dr. Amelio has served on the board of governors of the Electronics Industries Association and been a member of the executive committee of the Business and Higher Education Forum. He previously served on the boards of Chiron, Sematech and the American Film Institute and as chairman of the advisory board of the Georgia Institute of Technology.
Dr. Amelio, an IEEE Fellow, has been awarded 16 patents and is the recipient of numerous awards. He earned his BS, MS and PhD in physics at the Georgia Institute of Technology.
JEFFREY K. BELK joined InterDigital’s Board of Directors in March 2010. Mr. Belk is Managing Director of ICT168 Capital, LLC, focused on developing and guiding global growth opportunities in the ICT (Information and Communications Technology) space. Formerly, Mr. Belk spent almost 14 years at Qualcomm Incorporated, where prior to his departure in early 2008, he was Qualcomm’s Senior Vice President of Strategy and Market Development, focused on examining changes in the wireless ecosystem and formulating approaches to help accelerate mobile broadband adoption and growth.
From 2000 through 2006, Mr. Belk served as Senior Vice President, Global Marketing, leading a team responsible for all facets of the company’s corporate messaging, communications, and marketing worldwide. From 1999 to 2000, Mr. Belk was Senior Vice President & General Manager of Qualcomm Eudora Products, Qualcomm’s award-winning email client. In 1997, Mr. Belk was named Vice President, Marketing, of Qualcomm Consumer Products and initiated the company’s global branding and communications efforts.
Prior to Qualcomm, Mr. Belk spent ten years in the PC industry’s early growth stages, primarily with Proxima Corporation. Mr. Belk joined the company in 1983, when the company had fewer than 25 employees, and was with the company through its IPO in the early 1990s in several key distribution, product management, and international roles.
Mr. Belk is a member of the Boards of Directors of Peregrine Semiconductor and the Wireless Life Sciences Alliance, and is also on the Advisory Boards of CommNexus, Roundbox, and Exicon.
Mr. Belk earned his Bachelor of Arts degree in economics from the University of California, San Diego, and his MBA from the Paul Merage School of Business at the University of California, Irvine. He is known globally as a commentator and writer on wireless, mobile broadband, and technology evolution.
EDWARD B. KAMINS joined InterDigital’s Board of Directors in December 2003. Mr. Kamins is the principal member of UpFront Advisors, a business consulting services firm he founded in March 2009.
From July 1999 until his retirement in February 2009, Mr. Kamins served as Corporate Senior Vice President of Avnet, one of the world’s largest global distributors of electronic components, enterprise computing, and embedded subsystems. He joined Avnet in 1996 as Senior Vice President of Business Development for Avnet Computer Marketing. A long-time operational executive, Mr. Kamins was the founder and Group President of Avnet Applied Computing, which customized computer solutions for markets such as medical, telecommunications, gaming, and others. That business grew to $1.6B globally. Mr. Kamins served as Chief Information Officer beginning in July of 2004 and accepted the newly created post of Chief Operational Excellence Officer in July of 2006.
Mr. Kamins has held several high technology marketing and sales positions with a range of manufacturers and was involved in various startup ventures. His 16-year career with Digital Equipment culminated with the position of Vice President of Channels, with responsibility for a $1.5 billion North American channels business.
In April 2006, Mr. Kamins joined the Board of Directors of Calence, a leader in building, managing and optimizing customized, client-centric networks. Calence was acquired by Insight Enterprises in April 2008.
Mr. Kamins holds a bachelor’s degree in electrical engineering, with honors, from Stevens Institute of Technology and an MBA in marketing from the C.W. Post Center of Long Island University. His affiliations include a 12-year membership on the Board of Directors of the Lupus Foundation of America, where he was honored in May 2002 as the recipient of its annual Altruism Award.
JOHN A. KRITZMACHER joined InterDigital’s Board of Directors in June 2009. Mr. Kritzmacher served as Executive Vice President and Chief Financial Officer of Global Crossing Limited, a global provider of IP-based telecommunications solutions, from October 2008 to October 2011, when Global Crossing was acquired by Level 3 Communications, Inc.
Previously, Mr. Kritzmacher served as Chief Financial Officer at Lucent Technologies, where he managed functions including finance, accounting, treasury, tax, internal audit, investor relations and global real estate. Before becoming Chief Financial Officer, Mr. Kritzmacher rose through a variety of positions with increasing responsibility during his 10 years at Lucent, including Senior Vice President and Corporate Controller. After playing a leading role in the planning and execution of Lucent’s merger with Alcatel in 2006, Mr. Kritzmacher became Chief Operating Officer of the Services Business Group at Alcatel-Lucent. While there, he transformed a diverse suite of existing Alcatel and Lucent service functions into a unified global services organization. Earlier in his career, Mr. Kritzmacher advanced rapidly through a series of finance and operational roles at Lucent’s predecessor, AT&T Network Systems.
In September 2011, Mr. Kritzmacher joined the Board of Directors of Duff & Phelps Corporation, a leading independent provider of financial advisory and investment banking services.
Mr. Kritzmacher earned his bachelor’s degree in mathematics and economics at Dartmouth College and his MBA in accounting at the New York University Stern School of Business.
WILLIAM J. MERRITT has been President and Chief Executive Officer and a member of the Board of Directors of InterDigital since May 2005. Mr. Merritt has played a key role in managing InterDigital’s intellectual property assets and overseeing the growth of its patent licensing business. Mr. Merritt served as General Patent Counsel of InterDigital from July 2001 to May 2005 and also served as President of InterDigital Technology Corporation, a patent licensing subsidiary, from July 2001 to January 2008. Previously, Mr. Merritt served as Executive Vice President, General Counsel and Secretary of InterDigital.
Before joining InterDigital in 1996, Mr. Merritt served as Assistant General Counsel with the Long Island Lighting Company. Earlier on, Mr. Merritt concentrated his engineering efforts with Public Service Electric and Gas Company and Stone & Webster.
Mr. Merritt earned his bachelor’s degree in mechanical engineering from the Rensselaer Polytechnic Institute and a J.D. from Temple University. Mr. Merritt is admitted to practice law in the Commonwealth of Pennsylvania and the State of New York and before the U.S. District Courts for the Eastern and Southern Districts of New York, the U.S. Court of Appeals for the 11th Circuit and the U.S. Patent and Trademark Office.
JEAN F. RANKIN joined InterDigital’s Board of Directors in June 2010. Ms. Rankin is Executive Vice President, General Counsel and Secretary at LSI Corporation, a leading provider of innovative silicon, systems and software technologies for the global storage and networking markets. In this role, she serves LSI and its Board of Directors as Corporate Secretary, in addition to managing the company’s legal, intellectual property licensing and stock administration organizations.
Ms. Rankin joined LSI in 2007 as part of the merger with Agere Systems, where she was also Executive Vice President, General Counsel and Secretary. Prior to joining Agere in 2000, Ms. Rankin was responsible for corporate governance and corporate center legal support at Lucent Technologies, including mergers and acquisitions, securities laws, labor and employment, public relations, ERISA, investor relations and treasury. She also supervised legal support for Lucent’s microelectronics business.
Ms. Rankin received her law degree, with honors, from the University of Pennsylvania, and earned a bachelor’s degree with high distinction from the University of Virginia.
ROBERT S. ROATH joined InterDigital’s Board of Directors in May 1997. Mr. Roath served as Chief Financial Officer of RJR Nabisco before his retirement in 1997.
A long-time senior strategic and financial executive with diversified corporate and operating experience with various global companies, including Colgate-Palmolive, General Foods, GAF Corporation and Price Waterhouse, Mr. Roath has amassed achievements in operations, strategy formulation, business development and mergers and acquisitions.
Mr. Roath has been a director of Standard Parking, a provider of parking management services, since its IPO in May 2004 and became Chairman of its Board of Directors in October 2009. He also serves as Chairman of Standard Parking’s Compensation Committee. Mr. Roath has been Chairman of the Advisory Board to L.E.K. Consulting, a strategy and shareholder-value consulting firm, since May 1997.
Mr. Roath is a member of the Advisory Board to the Robert H. Smith School of Business at the University of Maryland, where he received his bachelor’s degree in accounting and economics in 1966. He is a registered CPA in the State of New York and has completed the Amos Tuck Executive Development program. Mr. Roath has been a speaker at various director seminars and was the keynote speaker at the first annual Business Ethics Conference at the University of Maryland.
Executive Management

WILLIAM J. MERRITT is InterDigital’s President and Chief Executive Officer, and a member of the Board of Directors.
Prior to becoming President and Chief Executive Officer, Mr. Merritt played a key role in building a program of licensing InterDigital's intellectual property and overseeing the growth in its patent licensing business. Before that, Mr. Merritt was Executive Vice President, General Counsel and Secretary of InterDigital. Prior to joining InterDigital in 1996, he served as Assistant General Counsel with the Long Island Lighting Company in Hicksville, NY. Earlier on, Mr. Merritt had concentrated his engineering efforts with Public Service Electric and Gas Company and Stone & Webster.
Mr. Merritt earned a Bachelor of Science degree in Mechanical Engineering from the Rensselaer Polytechnic Institute in 1980 and a Juris Doctorate from Temple University in 1987.

Richard J. Brezski is InterDigital’s Chief Financial Officer, responsible for overseeing the organization’s accounting, tax, treasury and purchasing functions, including the company’s internal and external financial reporting and analysis.
Mr. Brezski joined InterDigital as Director and Controller in May 2003. In July 2006, Mr. Brezski was promoted to Sr. Director and in January 2007 was appointed Chief Accounting Officer. In January 2009, Mr. Brezski was promoted to Vice President, Controller and Chief Accounting Officer, and in March 2011 he was appointed to the additional post of Treasurer. In May 2012, Mr. Brezski was appointed Chief Financial Officer. Prior to joining InterDigital, Mr. Brezski served as an audit manager for PricewaterhouseCoopers (PwC) in PwC’s technology, information, communication and entertainment practice where he provided business advisory and auditing services to product and service companies in the electronics, software and technology industries.
Mr. Brezski earned a Bachelor of Science in Accountancy from Villanova University and an Executive MBA from Hofstra University.

GARY D. ISAACS is InterDigital's Chief Administrative Officer, responsible for overseeing Human Resources, Information Systems Technology and Corporate Services across all InterDigital locations.
Mr. Isaacs joined InterDigital in September 1998, after spending three years at RCN Corporation, a rapidly emerging telecommunications company based in Princeton, NJ, where he was VP, Human Resources. Mr. Isaacs has more than 25 years of human resources management experience across several industries including telecom, aerospace and consumer products. He has worked for very large Fortune 50 companies including the Kraft Foods division of Philip Morris Cos. and Lockheed Martin, as well as small to medium size companies such as RCN Corp. Mr. Isaacs began his human resources career with People Express Airlines in 1983 and was part of the rapid growth and expansion of that upstart company.
Mr. Isaacs attended college at The University of Manchester, England as part of a select international communications program prior to graduating with a BA in journalism from Penn State University in 1981.

MARK A. LEMMO is InterDigital's Executive Vice President, Corporate Development, responsible for managing corporate initiatives through strategic investments and acquisitions that align with the company’s technology roadmap.
Mr. Lemmo has been with the company since 1987, and has led the establishment and growth of a number of key strategic partnerships. Previously, Mr. Lemmo held the positions of Executive Vice President, Corporate and Business Development, Business Development and Product Management, and Engineering and Product Operations. Mr. Lemmo possesses a deep understanding of wireless technologies and engineering operations, having received several patents in these areas. His knowledge of the telecommunications marketplace is a vital contributor to InterDigital’s strategic focus. Prior to joining InterDigital, Mr. Lemmo held positions with General Electric Corporation and RCA.
Mr. Lemmo earned a BA in Psychology and Liberal Arts from Temple University in 1980 and a BSEE from Temple University in 1983.

SCOTT A. MCQUILKIN is InterDigital's Senior Executive Vice President, Strategy and Finance, responsible for overseeing the organization’s strategy, corporate development and finance functions, including the company’s strategic acquisitions, dispositions and partnerships, business planning and analysis, and risk management efforts.
Mr. McQuilkin joined InterDigital as its Chief Financial Officer in 2007 with over 25 years of senior-level experience in financial management with public and privately-held companies in the high-tech and financial services sectors. He was appointed InterDigital’s Senior Executive Vice President, Strategy and Finance in May 2012. Prior to InterDigital, Mr. McQuilkin served as Chief Financial Officer for Metavante Lending Solutions, a high growth technology firm providing business process automation to the financial services industry. Mr. McQuilkin joined GHR Systems (which subsequently was acquired by Metavante Corporation), in 2000 as Chief Financial Officer and was responsible for finance, funding, acquisitions, accounting, strategy, human relations, facilities, and risk management. During his tenure, he led the company through a period of explosive growth and structured and negotiated several acquisitions. Prior to joining GHR Systems, Mr. McQuilkin served as Chief Financial Officer at De Lage Landen Financial Services and held senior finance positions at First Union Corporation.
Mr. McQuilkin earned a Master of Business Administration degree from The Wharton School in 1980 and a Bachelor of Science degree from Pennsylvania State University in 1976.

JAMES J. NOLAN is InterDigital's Executive Vice President, Research and Development, responsible for directing the development of advanced wireless technologies, including the incubation of advanced wireless communication solutions and the evolution of standards based technologies, and the company's participation in wireless standards bodies.
Since joining InterDigital in 1996, Mr. Nolan has held a variety of engineering and management positions, most recently as Executive Vice President of Engineering responsible for technology and product development since 2006. Prior to leading the Engineering organization he has led technology and product development of modems, protocol software and radio designs for multiple wireless standards. He also played a key role in business development activities around the world. Mr. Nolan came to InterDigital from the Northrop Grumman Corporation where he held technical and leadership roles on various engineering development programs.
Mr. Nolan earned a BSEE from the State University of New York at Buffalo, an MSEE from Polytechnic University, and an Executive MBA from Hofstra University.

JANET M. POINT is InterDigital's Executive Vice President, Investor Relations, responsible for managing the company’s relationship with the investment community.
Ms. Point joined InterDigital in January of 2000 as Director of Investor Relations to manage and build the company's relationship with the institutional and individual investment community. From January 2006 until March 2012, Ms. Point managed the company’s communications and investor relations efforts, holding responsibility for corporate communications, investor relations and marketing. Ms. Point's 25 years of experience in investor relations spans large, mid- and small-cap companies. In addition to her investor relations work, she has spearheaded communications and marketing efforts, including diversity initiatives, and served on various corporate committees including strategic planning, finance and government relations. Her career includes five years as Vice President of Investor Relations for Advanta Corporation and five years in the investor relations group at Fannie Mae. A member of the National Investor Relations Institute (NIRI) since 1987, Ms. Point served six years on the Board of the Philadelphia Chapter of NIRI, including the President's role from 2002 through June of 2004, and is a member of NIRI’s Senior Roundtable and the Investor Relations Association. Dedicated to her community, Ms. Point also serves on the Finance Council for the parish of Our Mother of Consolation Church in Philadelphia, PA.
Ms. Point received her MBA from the University of Michigan in 1983 and her BA in Economics and English from the University of Virginia in 1981.

Allen Proithis is InterDigital’s Vice President, Business Development and Strategic Solutions, responsible for establishing and developing strategic business relationships and identifying potential new business opportunities.
Mr. Proithis joined InterDigital in March 2012. Mr. Proithis was previously at TE Connectivity Ltd., a global designer and manufacturer of products that connect and protect the flow of power and data inside products, from January 2011 to October 2011 where he served as Senior Director – Strategy & Business Development, Consumer Devices division, covering the mobile, consumer electronics and PC industries. While at TE, he led a global team dedicated to strategy, M&A and strategic marketing, and was responsible for identifying new markets, channels and growth opportunities from product idea creation to execution.
Before joining TE, Mr. Proithis spent almost seven years at Hewlett-Packard Company, most recently as Head of Strategy & Business Development for the Handheld business unit. In this function, he drove all strategic initiatives for devices, software and services, including the launch of HP’s first mobile app store. Mr. Proithis had previously been the Director of Business Development in HP’s Personal Systems Group, where he built a partnership program with major telecommunications companies. His career also includes executive roles at HB Associates, an executive search and management consulting firm, Computer Sciences Corporation, Convergys and Electronic Data Systems.
Mr. Proithis earned a bachelor’s degree in Telecommunications from the Pennsylvania State University.

LAWRENCE F. SHAY is President of InterDigital’s Patent Holding Subsidiaries and is Executive Vice President of Intellectual Property and Chief IP Counsel for InterDigital, responsible for overseeing all activities pertaining to InterDigital’s patent licensing business, including managing the company’s intellectual property assets, negotiating and administering license agreements, and supervising IPR-related litigations.
Mr. Shay joined InterDigital in November 2001 as Chief Legal Officer, bringing more than 18 years of legal and management experience. He previously served as the General Counsel of a multi-national publicly-held professional services firm and from 1985 until 1999 Mr. Shay practiced corporate law with Dilworth Paxson LLP, a major Philadelphia law firm. Mr. Shay began his career in 1983 as an attorney working with U.S. District Court Judge Louis Bechtle in Philadelphia. Mr. Shay has lectured on commercial transactions at the Temple University School of Law and he has served on the Board of Trustees of the Delaware County Memorial Hospital Foundation and various Boards of the Crozer-Keystone Health System.
Mr. Shay earned his law degree, with honors, from the Temple University School of Law in 1983. He is a 1980 magna cum laude graduate of Saint Joseph's University, where he earned a Bachelor of Arts degree in Economics.

NARESH SONI is InterDigital's Chief Technology Officer, responsible for the company's technology strategy and roadmap, university and industry relationships and providing guidance on merger and acquisition opportunities.
Mr. Soni joined the company as Vice President of Strategic Engineering in July 2009. Prior to InterDigital, Naresh founded Exemplar Technologies, a consulting firm that provides innovative services and product development strategies to clients. Previously, he served as chief technology officer for Streamezzo, a venture-funded provider of interactive rich media solutions for some of the world’s leading handset manufacturers and wireless operators. Mr. Soni’s previous experience includes research and innovation-focused positions at STMicroelectronics, AT&T Bell Labs, and IBM, as well as the position of vice president of Computing Architecture Research Lab at Nokia.
Mr. Soni holds several patents, has authored technical papers and has given keynotes at conferences in the areas of communications and computing. Mr. Soni earned his Master of Science in Computer Engineering from the University of Texas, Austin, and Bachelor of Science in Electrical Engineering from the University of Mumbai. Naresh has served on the board of University of California San Diego (UCSD) Center for Wireless Communications and is currently on the advisory board of the UCSD school of Electrical and Computer Engineering.

STEVEN W. SPRECHER is InterDigital's General Counsel and Secretary, responsible for overseeing all activities pertaining to InterDigital’s legal and regulatory compliance issues.
Mr. Sprecher joined InterDigital in September 2007 as Deputy General Counsel, bringing more than 20 years of legal and management experience. He previously served as the Vice President, Legal at Mindspeed Technologies (a spin-off of Conexant Systems) and Associate General Counsel at Conexant Systems, Inc. Prior to those roles, Mr. Sprecher was Of Counsel at Gibson, Dunn and & Crutcher LLP in Irvine, California for three years, managing corporate and securities issues for clients. His previous eight years of experience include corporate and securities work both as inside counsel and as outside counsel.
Mr. Sprecher earned his JD and MBA from UCLA in 1987 and his BS in Physics from the US Naval academy in 1977, graduating in the top third of his respective classes. Mr. Sprecher served in the US Marine Corps from 1977 until 1983, receiving the Navy Achievement Medal in 1983 for superior performance. During his military career, he completed his US Naval Air Training Command coursework and earned his designation as a fighter pilot.
Taking Breakthrough Wireless Technologies
from Invention to Implementation
| Inventing Wireless Technologies As a widely-recognized pioneer in wireless, we develop fundamental technologies that drive mobile devices, infrastructure, and services – helping to shape the future of wireless. | ![]() | |||
| Contributing to Standards We are key contributors to many of the global standards bodies that define the technology requirements for more efficient wireless networks, a richer multimedia experience, and new mobile broadband capabilities. | ||||
| Licensing Our Patented Inventions Many of our inventions are patented and we license our comprehensive portfolio of intellectual property to leading brands and manufacturers – enabling many established and emerging players across the ever-expanding wireless ecosystem, ultimately benefitting billions of consumers around the world. | ||||
Licensing Our Advanced Technologies | ||||
We have a unique and integrated process that drives our highly synergistic business model. At InterDigital, everything starts with technology innovations, but we don’t just stop there.
Setting us apart is our ability to turn breakthrough thinking into practical solutions for the well-being of the entire wireless industry. We contribute many of our innovations to the wireless standards, and our active involvement in the standards organization gives us valuable insight into the future needs of the market.
We offer product manufacturers licenses to our patent portfolio. We are recognized and admired for our successful licensing program that enables many of the world’s leading wireless companies—a major part of our financial strength today. Further, we validate our inventions through real-world simulations and testing—then we license advanced product solutions and technologies to semiconductor producers and manufacturers of mobile devices. This full cycle— from technology inventions, to standards contributions, to patent licensing, and licensing technology solutions—is repeated with multiple technologies time and again. Our leading-edge thinkers are working today on solutions for the next generations of wireless technologies.
About InterDigital
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. As a long-standing contributor to the evolution of the wireless industry, we solve many of the industry’s most critical and complex technical challenges years ahead of market deployment.
Our advanced solutions support more efficient wireless networks, a richer multimedia experience, and new mobile broadband capabilities. Accordingly, we have established licenses and partnerships with many of the world’s leading wireless companies.
Our Goal: Drive Industry-wide Innovations in Wireless Technologies
Our strong financial performance is a tribute to the strength and pervasiveness of the inventions we have developed over the years, and we continue to invest in R&D to maximize shareholder value. Our successful patent licensing program, complemented by the licensing of our advanced technology solutions, positions InterDigital for tremendous growth in the global wireless industry.
Shaping the Industry
InterDigital has a rich history of pioneering wireless technologies for advanced voice and data communications. Our inventions in wireless modem design, air interface technology, and end-to-end system architecture are the foundation of the wireless networks and devices used by billions of mobile users around the world today. Building on the company’s legacy of innovation, we continue to make contributions to the leading standards bodies that define tomorrow’s wireless networks.
InterDigital’s R&D efforts are guided by our vision of tomorrow’s “Network of Networks”. This envisions the seamless integration of advanced cellular systems with multiple communications networks, which include other air interfaces that intelligently and constantly connect people and things across a myriad of wide, local and personal area networks.
At the same time, InterDigital is addressing the wireless bandwidth crunch and network congestion, focusing on three comprehensive areas of bandwidth innovations: spectrum optimization, cross-network connectivity and mobility, and intelligent data delivery techniques. In simpler terms, you can think of it as bigger pipes, more pipes, and better pipes.
To complement our internal R&D efforts, we build relationships with technology leaders within the wireless ecosystem and across the broadening domain of converged devices, networks, and services worldwide.














