InterDigital Engineers Named Editor-in-Chief of Newly-launched IoT Journal and Vice Chair of 3GPP RAN Working Group 2



InterDigital Engineers Named Editor-in-Chief of Newly-launched IoT Journal and Vice Chair of 3GPP RAN Working Group 2

InterDigital Engineers Named Editor-in-Chief of Newly-launched IoT Journal and Vice Chair of 3GPP RAN Working Group 2

September 6, 2013 / Posted By: jjohnston

The Institute of Electrical and Electronics Engineers (IEEE), the prestigious global engineering and standards body, will be launching a new publication called the IoT Journal (IoT-J) in 2014… and has appointed our own Chonggang Wang, a senior staff engineer in InterDigital Labs, as its inaugural Editor-in-Chief. The IEEE IoT-J will publish articles on the latest advances in, as well as review articles on, the various aspects of the Internet of Things (IoT), through open calls for articles as well as special issues on various topics. Areas will include IoT system architecture, enabling technologies, communication and networking protocols, services and applications, and even the social implications of IoT.

Another senior staff engineer in InterDigital Labs, Diana Pani, has been named the Vice Chair of 3GPP RAN working group 2. RAN2 is in charge of the Radio Interface architecture and protocols (MAC, RLC, PDCP), the specification of the Radio Resource Control protocol, the strategies of Radio Resource Management, and the services provided by the physical layer to the upper layers. Working on both UMTS (3G) and LTE (4G), Diana will chair the UMTS session while participating in LTE and other leadership discussions.

InterDigital has been a leader in research for standards-based solutions to UMTS, LTE, machine-to-machine and IoT challenges for many years, and is also the co-founder of the Convida Wireless M2M-focused joint venture with Sony. For a view of some of our research, please visit the InterDigital Vault at http://vault.interdigital.com and search for “M2M”, “UMTS”, or “LTE”.